公开(公告)号：US20180250622A1

公开(公告)日：2018-09-06

申请号：US15760174

申请日：2016-09-06

Applicant: Samsung Electronics Co., Ltd

Inventor： Jun Hyoun KWON ,  Jung Ho KIM ,  Seong Ryeol MYEONG ,  Baek YOUN ,  Gwan Taek KIM ,  Dae Yeon KIM ,  Mu Jung KIM ,  Tae Wi KIM

IPC: B01D46/00 ,  B01D46/44

Abstract: Disclosed are an air conditioner and a control method therefor. The air conditioner includes: a main body; a filter configured to filter impurities externally introduced into the main body; a fan configured to introduce the impurities into the main body through the filter; a sensor configured to detect a filter state value for determining a state of the filter; and a processor configured to determine that a replacement time of the filter arrives when an impurity purification capacity calculated on the basis of the filter state value detected in real time by the sensor is lower than a reference value.

公开(公告)号：US20140313696A1

公开(公告)日：2014-10-23

申请号：US14317204

申请日：2014-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae Yeon KIM ,  Young June JEONG ,  Hun Joo HAHM ,  Jae Hong SHIN ,  Chang Ho SHIN

IPC: G02F1/1335 ,  F21K99/00

CPC classification number: G02F1/133603 ,  F21K9/00 ,  F21K9/60 ,  G02F2001/133614 ,  G02F2001/133628 ,  H05K1/142

Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.

Abstract translation: 提供了包括发光的多个发光二极管（LED）的背光单元; 多个LED模块，具有支撑并驱动多个LED的印刷电路板（PCB）; 多个光学片，其附接到各个LED模块的顶表面; 以及附接到各个LED模块的后表面的多个散热垫。

公开(公告)号：US20130194790A1

公开(公告)日：2013-08-01

申请号：US13781037

申请日：2013-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Sam PARK ,  Hun Joo HAHM ,  Hyung Suk KIM ,  Seong Yeon HAN ,  Dae Hyun KIM ,  Do Hun KIM ,  Dae Yeon KIM

IPC: F21V21/005 ,  F21V13/08 ,  F21V29/00 ,  F21V9/16 ,  F21V13/02

CPC classification number: F21V21/005 ,  F21K9/00 ,  F21V13/02 ,  F21V13/08 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Abstract translation: 提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。 最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。