公开(公告)号：US20240213055A1

公开(公告)日：2024-06-27

申请号：US18524164

申请日：2023-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heeyun CHOI ,  Kyoungwhan OH ,  Hokyun KIM ,  Junhee LEE ,  Yohan CHOE

IPC: H01L21/67 ,  G03F7/16

CPC classification number: H01L21/6715 ,  G03F7/162 ,  H01L21/67051 ,  H01L21/67225

Abstract: A photoresist coating apparatus includes a photoresist trap tank temporarily storing a photoresist. A photoresist supply pipe is connected to the photoresist trap tank. A pump is connected to the photoresist supply pipe. A photoresist pressing device is connected to the photoresist supply pipe at a rear of the pump. A photoresist circulation pipe is at a rear of the photoresist pressing device. The photoresist circulation pipe connects the photoresist supply pipe to the photoresist trap tank. A photoresist discharge pipe is connected to the photoresist supply pipe at a rear of the photoresist circulation pipe. A photoresist discharge valve is connected to the photoresist discharge pipe. A photoresist discharge nozzle is connected to the photoresist discharge valve.