公开(公告)号：US20240136201A1

公开(公告)日：2024-04-25

申请号：US18381905

申请日：2023-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yuseon HEO ,  Junhyeong Park ,  Jieun Park ,  Jihye Shim ,  Jiyoung Lee

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L21/4857 ,  H01L23/3128 ,  H01L23/49838 ,  H01L25/18 ,  H10B80/00 ,  H01L24/04

Abstract: Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, coating a high transmittance photoresist on the first wiring structure a plurality of number of times, forming a plurality of openings by exposing and developing the high transmittance photoresist, forming a plurality of conductive posts by filling the plurality of openings with a conductive material, removing the high transmittance photoresist, disposing a semiconductor chip on the first wiring structure, forming an encapsulant surrounding the semiconductor chip and the plurality of conductive posts, and forming a second wiring structure on the encapsulant, wherein the light transmittance of the high transmittance photoresist at a portion where the first wiring structure and the high transmittance photoresist contact each other is greater than or equal to 3.2%.

公开(公告)号：US12223220B2

公开(公告)日：2025-02-11

申请号：US18341304

申请日：2023-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhyeong Park ,  Seogyong Jeong ,  Youngho Ryu ,  Jinbong Lee ,  Byeongguk Choi ,  Jungkyu Han

IPC: G06F1/16 ,  G06F3/14

Abstract: A display module may comprise: at least one first antenna configured to receive an image signal corresponding to the display module, from among a plurality of display modules configured to display an entire image, which displays at least a part of the entire image, a second antenna configured to receive a trigger signal corresponding to the image signal, a signal generation circuit configured to generate a plurality of control signals for controlling the image signal from the trigger signal received through the second antenna, and a display panel configured to display the image signal received from the first antenna on the basis of the plurality of generated control signals.

公开(公告)号：US20240234165A9

公开(公告)日：2024-07-11

申请号：US18381905

申请日：2023-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yuseon HEO ,  Junhyeong Park ,  Jieun Park ,  Jihye Shim ,  Jiyoung Lee

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L21/4857 ,  H01L23/3128 ,  H01L23/49838 ,  H01L25/18 ,  H10B80/00 ,  H01L24/04

Abstract: Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, coating a high transmittance photoresist on the first wiring structure a plurality of number of times, forming a plurality of openings by exposing and developing the high transmittance photoresist, forming a plurality of conductive posts by filling the plurality of openings with a conductive material, removing the high transmittance photoresist, disposing a semiconductor chip on the first wiring structure, forming an encapsulant surrounding the semiconductor chip and the plurality of conductive posts, and forming a second wiring structure on the encapsulant, wherein the light transmittance of the high transmittance photoresist at a portion where the first wiring structure and the high transmittance photoresist contact each other is greater than or equal to 3.2%.

公开(公告)号：US20240136332A1

公开(公告)日：2024-04-25

申请号：US18483545

申请日：2023-10-10

Applicant: Samsung Electronics Co., Ltd

Inventor： Yuseon Heo ,  Jihye Shim ,  Junhyeong Park

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/48106 ,  H01L2224/73215 ,  H01L2225/06527

Abstract: Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, forming a multi-layer photoresist on the first wiring structure, forming a plurality of openings in the multi-layer photoresist by exposing and developing the multi-layer photoresist, forming a plurality of conductive posts by forming a conductive material in the plurality of openings, removing the multi-layer photoresist, providing a semiconductor chip on the first wiring structure, forming an encapsulant on the semiconductor chip and the plurality of conductive posts, and forming a second wiring structure on the encapsulant, wherein the multi-layer photoresist includes at least two layers having different light transmittances.

公开(公告)号：US11474571B2

公开(公告)日：2022-10-18

申请号：US17177542

申请日：2021-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogyong Jeong ,  Junhyeong Park ,  Jaehyuck Shin ,  Youngho Ryu ,  Byeongguk Choi ,  Sungku Yeo ,  Chongmin Lee

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G09F9/33 ,  H02J50/00

Abstract: A display panel module and an electronic device is provided, the display pane module including a plurality of display panel modules. According to the disclosure, an electronic device comprises: a housing, a cover glass, a plurality of display panels disposed adjacent to a rear surface of the cover glass in the housing, a plurality of first heat dissipation plates disposed adjacent to rear surfaces of the plurality of display panels in the housing, a plurality of power/data reception circuit boards disposed adjacent to rear surfaces of the plurality of first heat dissipation plates in the housing, a support configured to support at least a portion of the plurality of power/data reception circuit boards, and a power/data transmission circuit board having at least a portion contacting and supported by the support and spaced apart by a predetermined distance from the plurality of power/data reception circuit boards in a space provided by the support. The power/data transmission circuit board includes a plurality of first antennas corresponding to a plurality of second antennas included in each of the plurality of power/data reception circuit boards and a transmission resonator corresponding to a plurality of reception resonators included in each of the plurality of power/data reception circuit boards.