公开(公告)号：US20190086794A1

公开(公告)日：2019-03-21

申请号：US15942795

申请日：2018-04-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho YU ,  Myoung-soo CHOI ,  Dong-wook KIM ,  Jung-wook KIM ,  Ki-ju SOHN ,  Sung-kyu LEE ,  Eun-soo HWANG

IPC: G03F7/00 ,  B29C33/38 ,  B29C43/58 ,  B29C43/36 ,  B29C43/50

Abstract: An imprint apparatus including a stage supporting a stamp master on which a master pattern for forming a stamping pattern on a flexible substrate is formed, or a substrate on which a pattern corresponding to the stamping pattern is formed by contact with the stamping pattern; a roll-to-roll mover to move the flexible substrate along a path adjacent to the stage; a clamp including a front clamp that secures a first portion of the flexible substrate, and a rear clamp that secures a second portion of the flexible substrate spaced apart from the first portion; a pressure roller to press the flexible substrate so that the flexible substrate secured by the clamp is brought into contact with the substrate or the stamp master; and a clamp driving controller to drive the clamp to adjust tension between the first portion and the second portion.

公开(公告)号：US20140265903A1

公开(公告)日：2014-09-18

申请号：US14189554

申请日：2014-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-soo PARK ,  Min-young SON ,  Myoung-soo CHOI

IPC: H05B33/08

CPC classification number: H05B33/0809 ,  H01L24/73 ,  H01L25/167 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/15787 ,  H05B33/0803 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2224/45099

Abstract: A light-emitting device package including: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit.

Abstract translation: 一种发光器件封装，包括：封装衬底; 布置在所述封装衬底的顶表面上的第一至第五导电图案; 设置在所述第一和第二导电图案上的第一整流电路; 设置在第五导电图案上并电连接到第一整流电路的第一发光器件; 设置在第三和第四导电图案上的第二整流电路; 以及设置在第五导电图案上并电连接到第二整流电路的第二发光器件。