公开(公告)号：US20140265903A1

公开(公告)日：2014-09-18

申请号：US14189554

申请日：2014-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-soo PARK ,  Min-young SON ,  Myoung-soo CHOI

IPC: H05B33/08

CPC classification number: H05B33/0809 ,  H01L24/73 ,  H01L25/167 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/15787 ,  H05B33/0803 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2224/45099

Abstract: A light-emitting device package including: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit.

Abstract translation: 一种发光器件封装，包括：封装衬底; 布置在所述封装衬底的顶表面上的第一至第五导电图案; 设置在所述第一和第二导电图案上的第一整流电路; 设置在第五导电图案上并电连接到第一整流电路的第一发光器件; 设置在第三和第四导电图案上的第二整流电路; 以及设置在第五导电图案上并电连接到第二整流电路的第二发光器件。

公开(公告)号：US20160262230A1

公开(公告)日：2016-09-08

申请号：US14969191

申请日：2015-12-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-soo PARK

IPC: H05B33/08 ,  H01L33/62 ,  H01L25/16 ,  H01L25/075

CPC classification number: H05B33/0821 ,  H01L24/73 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/382 ,  H01L33/486 ,  H01L2224/24137 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73227 ,  H01L2224/73265 ,  H05B33/0803 ,  H01L2924/00014

Abstract: A light-emitting device package includes a substrate; a light-emitting device provided on the substrate and configured to be driven by an AC power supply; and a capacitor connected in series with the light-emitting device, where a capacitance of the capacitor varies so that a current flowing through the light-emitting device and flowing through the capacitor is maintained at a constant value according to a variation in temperatures of the light-emitting device and the capacitor.

Abstract translation: 发光器件封装包括衬底; 设置在所述基板上并被配置为由AC电源驱动的发光装置; 以及与发光装置串联连接的电容器，其中电容器的电容变化，使得流过发光器件并流过电容器的电流根据温度变化而保持在恒定值 发光装置和电容器。