公开(公告)号：US20240128102A1

公开(公告)日：2024-04-18

申请号：US18125853

申请日：2023-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNGHO JANG ,  HYUNGJIN KIM ,  MINHWAN SEO ,  AKINORI OKUBO ,  SANGMIN LEE ,  SINYONG LEE ,  WONDON JOO ,  SANGJOON HONG

IPC: H01L21/67 ,  G01B11/06

CPC classification number: H01L21/67259 ,  G01B11/0608

Abstract: An apparatus monitoring semiconductor manufacturing equipment includes; an optical detector, a light generator generating light along a first optical path towards a semiconductor substrate, wherein upon irradiating the semiconductor substrate, the light becomes reflected light along a second optical path away from the semiconductor substrate and towards the optical detector, a first grating reticle between the light generator and the semiconductor substrate and including first slits having a first pitch and second slits having a second pitch different from the first pitch, a second grating reticle between the semiconductor substrate and the optical detector and including third slits having a third pitch different from the first pitch and the second pitch, wherein the optical detector determines a positional attribute of the semiconductor substrate in relation to a first pattern and a second pattern, the first pattern corresponds to a first portion of light/reflected light sequentially passing through the first slits and the third slits, and the second pattern corresponds to a second portion of light/reflected light sequentially passing through the second slits and the third slits.