公开(公告)号：US20240145315A1

公开(公告)日：2024-05-02

申请号：US18495618

申请日：2023-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： EUNHEE JEANG ,  BORIS AFINOGENOV ,  SANGWOO BAE ,  WONDON JOO ,  MAKSIM RIABKO ,  ANTON MEDVEDEV ,  ALEKSANDR SHOROKHOV ,  ANTON SOFRONOV ,  INGI KIM ,  TAEHYUN KIM ,  MINHWAN SEO ,  SANGMIN LEE ,  SEULGI LEE

IPC: H01L21/66 ,  G01N21/64 ,  G01N21/95 ,  H01L21/67

CPC classification number: H01L22/12 ,  G01N21/648 ,  G01N21/9505 ,  H01L21/67288 ,  G01N2201/06113

Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.

公开(公告)号：US20240128102A1

公开(公告)日：2024-04-18

申请号：US18125853

申请日：2023-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNGHO JANG ,  HYUNGJIN KIM ,  MINHWAN SEO ,  AKINORI OKUBO ,  SANGMIN LEE ,  SINYONG LEE ,  WONDON JOO ,  SANGJOON HONG

IPC: H01L21/67 ,  G01B11/06

CPC classification number: H01L21/67259 ,  G01B11/0608

Abstract: An apparatus monitoring semiconductor manufacturing equipment includes; an optical detector, a light generator generating light along a first optical path towards a semiconductor substrate, wherein upon irradiating the semiconductor substrate, the light becomes reflected light along a second optical path away from the semiconductor substrate and towards the optical detector, a first grating reticle between the light generator and the semiconductor substrate and including first slits having a first pitch and second slits having a second pitch different from the first pitch, a second grating reticle between the semiconductor substrate and the optical detector and including third slits having a third pitch different from the first pitch and the second pitch, wherein the optical detector determines a positional attribute of the semiconductor substrate in relation to a first pattern and a second pattern, the first pattern corresponds to a first portion of light/reflected light sequentially passing through the first slits and the third slits, and the second pattern corresponds to a second portion of light/reflected light sequentially passing through the second slits and the third slits.

公开(公告)号：US20210305106A1

公开(公告)日：2021-09-30

申请号：US17021087

申请日：2020-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： EUNHEE JEANG ,  BORIS AFINOGENOV ,  SANGWOO BAE ,  WONDON JOO ,  MAKSIM RIABKO ,  ANTON MEDVEDEV ,  ALEKSANDR SHOROKHOV ,  ANTON SOFRONOV ,  INGI KIM ,  TAEHYUN KIM ,  MINHWAN SEO ,  SANGMIN LEE ,  SEULGI LEE

IPC: H01L21/66 ,  H01L21/67 ,  G01N21/64 ,  G01N21/95

Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.