公开(公告)号：US11800686B2

公开(公告)日：2023-10-24

申请号：US17659766

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  G11B33/14 ,  H05K1/02

CPC classification number: H05K7/20436 ,  G11B33/1426 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20163 ,  G11B33/142

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

公开(公告)号：US12094803B2

公开(公告)日：2024-09-17

申请号：US17454119

申请日：2021-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Duksoo Kim ,  Hu Zhao ,  Bumjun Kim

IPC: H01L23/00 ,  H01L23/467 ,  H01L25/065 ,  H01L25/18 ,  H05K1/14 ,  H05K7/20 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01L23/467 ,  H01L25/0652 ,  H01L25/18 ,  H05K1/144 ,  H05K7/20163 ,  H05K7/20736 ,  H05K1/148 ,  H05K1/18 ,  H05K5/0047 ,  H05K5/0069 ,  H05K2201/10159

Abstract: A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

公开(公告)号：US11317540B2

公开(公告)日：2022-04-26

申请号：US16985290

申请日：2020-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  H05K1/02 ,  G11B33/14

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.