公开(公告)号：US20240321682A1

公开(公告)日：2024-09-26

申请号：US18394575

申请日：2023-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggyu Lee ,  Jaechoon Kim ,  Youngjoon Koh ,  Taehwan Kim

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/528 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/473 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/44 ,  H01L24/32 ,  H01L25/18 ,  H10B80/00 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1431

Abstract: Provided is a semiconductor package including a package substrate, a semiconductor device mounted on the package substrate, and a heat dissipation structure attached onto the semiconductor device, wherein the heat dissipation structure includes a plurality of vapor chambers at different levels in the vertical direction and a plurality of heat pipes extending between the plurality of vapor chambers.

公开(公告)号：US20240413053A1

公开(公告)日：2024-12-12

申请号：US18410761

申请日：2024-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngjoon Koh ,  Jae Choon Kim

IPC: H01L23/427 ,  H01L23/00

Abstract: Disclosed are heat radiation devices and semiconductor apparatuses including the same. The semiconductor apparatus comprises a substrate, a plurality of semiconductor devices on the substrate and arranged in a first direction as a horizontal direction, and a heat radiation device on the plurality of semiconductor devices. The heat radiation device provides a plurality of vapor chambers. The plurality of vapor chambers are spaced apart from each other in the first direction and are not connected to each other.