公开(公告)号：US12230575B2

公开(公告)日：2025-02-18

申请号：US17517798

申请日：2021-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeongmun Kang ,  Woodong Lee ,  Insup Shin ,  Youngwoo Lim

IPC: H01L23/538 ,  H01L25/065

Abstract: A carrier structure including semiconductor chip stack structures; and a carrier tape including a plurality of pockets respectively accommodating the semiconductor chip stack structures, wherein each of the plurality of pockets includes a bottom surface, first sidewalls in four corner regions of each of the plurality of pockets, and second sidewalls between adjacent first sidewalls, each of the first sidewalls has a first portion having a first inclination angle and a second portion on the first portion and having a second inclination angle, the second inclination angle being greater than the first inclination angle, and vertices of lower surfaces of the semiconductor chip stack structures are in contact with the first sidewalls.

公开(公告)号：US20230420403A1

公开(公告)日：2023-12-28

申请号：US18165419

申请日：2023-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeonjun Song ,  Jungmin Ko ,  Taehyeong Kim ,  Youngwoo Lim ,  Dongki Choi

IPC: H01L23/00 ,  H01L25/18 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L25/18 ,  H01L23/3107 ,  H01L24/16 ,  H01L24/73 ,  H01L24/83 ,  H01L24/13 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/83007 ,  H01L2224/26125 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13113 ,  H01L2224/13118

Abstract: A semiconductor package includes a base chip; semiconductor chips stacked on the base chip; bumps, a lowermost bump of the bumps disposed between the base chip and a lowermost semiconductor chip of the semiconductor chips, and each of the bumps except the lowermost bump respectively disposed between the semiconductor chips; organic material layers, a lowermost organic material layer of the organic material layers disposed between the base chip and the lowermost semiconductor chip, and each of organic material layers except the lowermost organic material layer respectively disposed between the plurality of semiconductor chips; underfill layers respectively surrounding the plurality of bumps, the underfill layers extending between the base chip and the lowermost semiconductor chip and between the semiconductor chips; and an encapsulant covering the base chip, the semiconductor chips, and the underfill layers.