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公开(公告)号：US12094129B2
公开(公告)日：2024-09-17
申请号：US17144488
申请日：2021-01-08
发明人： Jaeha Lee , Taehyeong Kim , Hyunjung Nam , Jaebum Park , Joonah Park
IPC分类号： G06K9/00 , G01S17/08 , G01S17/89 , G06T7/246 , G06V10/80 , G06V20/10 , G06V40/10 , H04N23/695
CPC分类号： G06T7/248 , G01S17/08 , G01S17/89 , G06V10/811 , G06V20/10 , G06V40/103 , H04N23/695
摘要： An electronic apparatus is provided. The electronic apparatus includes a camera, a Light Detection And Ranging (LiDAR) sensor, and a processor configured to track an object based on a plurality of images photographed by the camera sequentially, wherein, to track the object based on the plurality of images, the processor is configured to, based on the object being identified in a first image from among a plurality of images and subsequently, not being identified in a second image after the first image, control a photographing direction of the camera based on scanning information obtained by the LiDAR sensor.
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公开(公告)号：US20210149498A1
公开(公告)日：2021-05-20
申请号：US17081597
申请日：2020-10-27
发明人： Joonah PARK , Jaeyong Ju , Taehyeong Kim , Jaeha Lee
摘要： An electronic apparatus is provided. The electronic apparatus includes a camera; a memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction to: detect at least one object included in an image captured by the camera; identify information on an engagement of each of the at least one object with the electronic apparatus; obtain gesture information of each of the at least one object; obtain a target object from among the at least one object based on an operation status of the electronic apparatus, the information on the engagement of each of the at least one object, and the obtained gesture information of each of the at least one object; identify a function corresponding to gesture information of the target object; and execute the identified function.
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公开(公告)号：US10964670B2
公开(公告)日：2021-03-30
申请号：US16225074
申请日：2018-12-19
发明人： Taehyeong Kim , Young Lyong Kim , Geol Nam
IPC分类号： H01L25/065 , H01L23/00 , H01L23/31 , H01L21/56 , H01L25/00
摘要： Disclosed are semiconductor packages and methods of manufacturing the same. The method of manufacturing a semiconductor package may include providing a carrier substrate having a trench formed on a first top surface of the carrier substrate, providing a first semiconductor chip on the carrier substrate, mounting at least one second semiconductor chip on a second top surface of the first semiconductor chip, coating a mold member to surround a first lateral surface of the first semiconductor chip and a second lateral surface of the at least one second semiconductor chip, and curing the mold member to form a mold layer. The trench may be provided along a first edge of the first semiconductor chip. The mold member may cover a second edge of a bottom surface the first semiconductor chip.
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公开(公告)号：US20230420403A1
公开(公告)日：2023-12-28
申请号：US18165419
申请日：2023-02-07
发明人： Hyeonjun Song , Jungmin Ko , Taehyeong Kim , Youngwoo Lim , Dongki Choi
CPC分类号： H01L24/32 , H01L25/18 , H01L23/3107 , H01L24/16 , H01L24/73 , H01L24/83 , H01L24/13 , H01L2224/16145 , H01L2224/32145 , H01L2224/73204 , H01L2224/83007 , H01L2224/26125 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13113 , H01L2224/13118
摘要： A semiconductor package includes a base chip; semiconductor chips stacked on the base chip; bumps, a lowermost bump of the bumps disposed between the base chip and a lowermost semiconductor chip of the semiconductor chips, and each of the bumps except the lowermost bump respectively disposed between the semiconductor chips; organic material layers, a lowermost organic material layer of the organic material layers disposed between the base chip and the lowermost semiconductor chip, and each of organic material layers except the lowermost organic material layer respectively disposed between the plurality of semiconductor chips; underfill layers respectively surrounding the plurality of bumps, the underfill layers extending between the base chip and the lowermost semiconductor chip and between the semiconductor chips; and an encapsulant covering the base chip, the semiconductor chips, and the underfill layers.
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公开(公告)号：US20220278010A1
公开(公告)日：2022-09-01
申请号：US17464002
申请日：2021-09-01
发明人： Hyeongmun Kang , Taehyeong Kim , Woodong Lee , Hwanyoung Choi
IPC分类号： H01L23/31 , H01L25/065 , H01L25/00 , H01L23/00 , H01L21/56
摘要： A semiconductor package includes a base structure, a lower semiconductor chip disposed on the base structure, an upper semiconductor chip disposed on the lower semiconductor chip, a connecting structure including a lower pad disposed on the lower semiconductor chip, an upper pad disposed under the upper semiconductor chip, and a connecting bump disposed between the lower pad and the upper pad, a dummy chip disposed on the upper semiconductor chip, an upper adhesive layer including an upper adhesive portion disposed between the upper semiconductor chip and the dummy chip, and an upper protrusion portion disposed at opposite sides of the upper adhesive portion, to surround lower portions of opposite side surfaces of the dummy chip, and a molding layer disposed at opposite sides of the dummy chip, to surround upper portions of the opposite side surfaces of the dummy chip and the upper protrusion portion.
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公开(公告)号：US11257725B2
公开(公告)日：2022-02-22
申请号：US17010059
申请日：2020-09-02
发明人： Taehyeong Kim , Hyeongmun Kang , Seungduk Baek
摘要： Disclosed is a semiconductor package comprising a first semiconductor chip and at least one second semiconductor chip on the first semiconductor chip. The second semiconductor chip includes first and second test bumps that are adjacent to an edge of the second semiconductor chip and are on a bottom surface of the second semiconductor chip. The first and second test bumps are adjacent to each other. The second semiconductor chip also includes a plurality of data bumps that are adjacent to a center of the second semiconductor chip and are on the bottom surface of the second semiconductor chip. A first interval between the second test bump and one of the data bumps is greater than a second interval between the first test bump and the second test bump. The one of the data bumps is most adjacent to the second test bump.
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公开(公告)号：US12125753B2
公开(公告)日：2024-10-22
申请号：US17584776
申请日：2022-01-26
发明人： Taehyeong Kim , Hyeongmun Kang , Seungduk Baek
IPC分类号： H01L21/66 , H01L23/00 , H01L25/065 , H01L25/10 , H01L25/18
CPC分类号： H01L22/34 , H01L24/14 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/18 , H01L2224/1412 , H01L2224/14515 , H01L2224/16148 , H01L2224/17132 , H01L2224/17133 , H01L2224/17515 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2225/06596 , H01L2225/1058 , H01L2924/1431 , H01L2924/1436
摘要： Disclosed is a semiconductor package comprising a first semiconductor chip and at least one second semiconductor chip on the first semiconductor chip. The second semiconductor chip includes first and second test bumps that are adjacent to an edge of the second semiconductor chip and are on a bottom surface of the second semiconductor chip. The first and second test bumps are adjacent to each other. The second semiconductor chip also includes a plurality of data bumps that are adjacent to a center of the second semiconductor chip and are on the bottom surface of the second semiconductor chip. A first interval between the second test bump and one of the data bumps is greater than a second interval between the first test bump and the second test bump. The one of the data bumps is most adjacent to the second test bump.
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公开(公告)号：US11721601B2
公开(公告)日：2023-08-08
申请号：US17095210
申请日：2020-11-11
发明人： Hyeongmun Kang , Jungmin Ko , Seungduk Baek , Taehyeong Kim , Insup Shin
IPC分类号： H01L23/24 , H01L23/31 , H01L21/56 , H01L23/538 , H01L23/00
CPC分类号： H01L23/24 , H01L21/565 , H01L23/3107 , H01L23/5385 , H01L24/13 , H01L2924/1434 , H01L2924/3511
摘要： A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the substrate and the plurality of semiconductor devices, and molding resin surrounding the plurality of semiconductor devices. At least one of the underfill fillets is exposed from side surfaces of the molding resin.
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公开(公告)号：US11635821B2
公开(公告)日：2023-04-25
申请号：US17081597
申请日：2020-10-27
发明人： Joonah Park , Jaeyong Ju , Taehyeong Kim , Jaeha Lee
摘要： An electronic apparatus is provided. The electronic apparatus includes a camera; a memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction to: detect at least one object included in an image captured by the camera; identify information on an engagement of each of the at least one object with the electronic apparatus; obtain gesture information of each of the at least one object; obtain a target object from among the at least one object based on an operation status of the electronic apparatus, the information on the engagement of each of the at least one object, and the obtained gesture information of each of the at least one object; identify a function corresponding to gesture information of the target object; and execute the identified function.
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公开(公告)号：US11948484B2
公开(公告)日：2024-04-02
申请号：US18328202
申请日：2023-06-02
发明人： Seungkyu Choi , Hanyuool Kim , Taehyeong Kim , Yunpyo Hong
IPC分类号： G09G3/00 , G06F1/16 , G09G3/3208
CPC分类号： G09G3/006 , G06F1/1652 , G09G3/035 , G09G3/3208 , G09G2320/046
摘要： An electronic device with a rollable display may include the operations of: obtaining global burn-in information and local burn-in information according to a designated sampling period; on the basis of the result of analyzing the global burn-in information, predicting whether burn-in will at least partially occur in the entire area of a display area; when burn-in is predicted to at least partially occur in a boundary area, generating a first compensation map including pieces of local compensation data calculated to correspond to m block areas of the boundary area, respectively; when burn-in is predicted to at least partially occur in an area remaining after excluding the boundary area from the entire area, generating a second compensation map including pieces of global compensation data calculated to correspond to n block areas of the entire area, respectively; and controlling the rollable display to display image data compensated on the basis of the first compensation map or the second compensation map.
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