公开(公告)号：US11516950B2

公开(公告)日：2022-11-29

申请号：US16766363

申请日：2018-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin Jin ,  Min Park ,  Jaedeok Lim ,  Jungje Bang ,  Jaeheung Ye ,  Yongwon Lee ,  Seyoung Jang

IPC: H05K9/00 ,  H05K1/18 ,  H01Q1/24 ,  H01Q1/52 ,  H04M1/02 ,  H01Q1/44

Abstract: The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.

公开(公告)号：US12279371B2

公开(公告)日：2025-04-15

申请号：US17886327

申请日：2022-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin Jin ,  Jichul Kim ,  Yongjae Song ,  Jaeyeon Ra ,  Chagyu Song

IPC: H05K1/14 ,  H05K1/02

Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.

公开(公告)号：US20250096186A1

公开(公告)日：2025-03-20

申请号：US18970353

申请日：2024-12-05

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Chagyu SONG ,  Hoyeon Seo ,  Jaeyeon Ra ,  Kookjin Park ,  Chulwoo Park ,  Dongjun Shin ,  Jongbum Lee ,  Gyeongmin Jin

IPC: H01L23/00 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H10B80/00

Abstract: An electronic device may be provided and include: a printed circuit board includes a first side and a second side perpendicular to the first side; a plurality of solder balls on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit, the electronic component on at least some of the plurality of solder balls; a resin along the first side and filling a portion of a space between the surface of the printed circuit board and the electronic component; and a blocking structure in or on the surface of the printed circuit board, the blocking structure being between the plurality of solder balls and the first side, and extending along the first side such as to separate the at least some of the plurality of solder balls from the resin.

公开(公告)号：US12232259B2

公开(公告)日：2025-02-18

申请号：US18107129

申请日：2023-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongsoo Kim ,  Gyeongmin Jin ,  Hakjoon Kim ,  Jaebum Lee

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/34

Abstract: An electronic device according to an embodiment may include: a Printed Circuit Board (PCB) including a first face and a second face; a semiconductor chip mounted on the second face; a conductive pad disposed on the second face; a solder resist layer disposed on the second face and including an aperture; an arc-shaped opening having an inner diameter and an outer diameter, disposed along an outer periphery of the conductive pad and in the aperture; and at least one external terminal disposed on the semiconductor chip and bonded to the conductive pad. The conductive pad may include: a first region having a smaller diameter than the outer diameter; and at least one second region extending from the first region in a first outer circumferential direction, and located at least in part between both ends of the opening. In addition, various embodiments recognized through the specification may also be possible.