-
公开(公告)号：US11991823B2
公开(公告)日：2024-05-21
申请号：US17333972
申请日：2021-05-28
发明人： Chih-Yi Lin , Kuo-Kuang Cheng , Chi-Chin Chiang , Wen-Hsin Tai , I-Ju Wu , Chi-Ho Tien
CPC分类号： H05K1/036 , B29C48/0021 , B29C48/022 , C08L75/04 , C09D11/52 , B29K2075/00 , B29K2995/0016 , C08L2207/04
摘要： The present disclosure is relates to a conductive film and a manufacturing method thereof. The conductive film includes a base layer, a TPU complex layer, a conductive layer and a TPU surface layer. The TPU complex layer includes a TPU heat-resistant layer and a TPU melting layer. The TPU heat-resistant layer is disposed on the TPU melting layer, and the TPU melting layer is disposed on the base layer. The conductive layer includes a conductive circuit disposed on the TPU heat-resistant layer. The TPU surface layer is disposed on the conductive layer. Utilizing the TPU complex layer, the conductive layer does not contact directly with the base layer to avoid breaking the conductive line of the conductive layer when the base layer is pulled. Therefore, the lifetime of the conductive film can be increased.
-
公开(公告)号：US20240260183A1
公开(公告)日：2024-08-01
申请号：US18632963
申请日：2024-04-11
发明人： Chih-Yi Lin , Kuo-Kuang Cheng , Chi-Chin Chiang , Wen-Hsin Tai , I-Ju Wu , Chi-Ho Tien
CPC分类号： H05K1/036 , B29C48/0021 , B29C48/022 , C08L75/04 , C09D11/52 , B29K2075/00 , B29K2995/0016 , C08L2207/04
摘要： The present disclosure is relates to a conductive film and a manufacturing method thereof. The conductive film includes a base layer, a TPU complex layer, a conductive layer and a TPU surface layer. The TPU complex layer includes a TPU heat-resistant layer and a TPU melting layer. The TPU heat-resistant layer is disposed on the TPU melting layer, and the TPU melting layer is disposed on the base layer. The conductive layer includes a conductive circuit disposed on the TPU heat-resistant layer. The TPU surface layer is disposed on the conductive layer. Utilizing the TPU complex layer, the conductive layer does not contact directly with the base layer to avoid breaking the conductive line of the conductive layer when the base layer is pulled. Therefore, the lifetime of the conductive film can be increased.
-
搜索结果
2 条记录 (耗时 0.012 秒)
