公开(公告)号：US20200251374A1

公开(公告)日：2020-08-06

申请号：US16263086

申请日：2019-01-31

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Raghuveer S. MAKALA ,  Senaka KANAKAMEDALA ,  Yao-Sheng LEE ,  Jian CHEN

IPC: H01L21/687 ,  H01L23/00 ,  H01L23/522 ,  H01L27/11582 ,  H01L27/11565

Abstract: A first semiconductor die and a second semiconductor die can be bonded in a manner that enhances alignment of bonding pads. Non-uniform deformation of a first wafer including first semiconductor dies can be compensated for by forming a patterned stress-generating film on a backside of the first wafer. Metallic bump portions can be formed on concave surfaces of metallic bonding pads by a selective metal deposition process to reduce gaps between pairs of bonded metallic bonding pads. Pad-to-pad pitch can be adjusted on a semiconductor die to match the pad-to-pad pitch of another semiconductor die employing a tilt-shift operation in a lithographic exposure tool. A chuck configured to provide non-uniform displacement across a wafer can be employed to hold a wafer in a contoured shape for bonding with another wafer in a matching contoured position. Independently height-controlled pins can be employed to hold a wafer in a non-planar configuration.

公开(公告)号：US20200251443A1

公开(公告)日：2020-08-06

申请号：US16263058

申请日：2019-01-31

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Senaka KANAKAMEDALA ,  Raghuveer S. MAKALA ,  Yao-Sheng LEE ,  Jian CHEN

IPC: H01L23/00 ,  H01L25/18 ,  H01L23/522 ,  H01L23/538 ,  H01L21/822 ,  H01L21/033

Abstract: A first semiconductor die and a second semiconductor die can be bonded in a manner that enhances alignment of bonding pads. Non-uniform deformation of a first wafer including first semiconductor dies can be compensated for by forming a patterned stress-generating film on a backside of the first wafer. Metallic bump portions can be formed on concave surfaces of metallic bonding pads by a selective metal deposition process to reduce gaps between pairs of bonded metallic bonding pads. Pad-to-pad pitch can be adjusted on a semiconductor die to match the pad-to-pad pitch of another semiconductor die employing a tilt-shift operation in a lithographic exposure tool. A chuck configured to provide non-uniform displacement across a wafer can be employed to hold a wafer in a contoured shape for bonding with another wafer in a matching contoured position. Independently height-controlled pins can be employed to hold a wafer in a non-planar configuration.