公开(公告)号：US20230018637A1

公开(公告)日：2023-01-19

申请号：US17955206

申请日：2022-09-28

Applicant: SEMES CO., LTD.

Inventor： YONG HEE LEE ,  YOUNG HUN LEE ,  JINWOO JUNG ,  EUI SANG LIM

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US20220351968A1

公开(公告)日：2022-11-03

申请号：US17867813

申请日：2022-07-19

Applicant: SEMES CO., LTD.

Inventor： JINWOO JUNG ,  YOUNG HUN LEE ,  YONG HEE LEE ,  EUI SANG LIM

IPC: H01L21/02 ,  F26B3/02 ,  H01L21/67 ,  F26B21/14

Abstract: A method for treating a substrate is provided. The method includes the following steps: performing a process of treating the substrate by dispensing a supercritical fluid onto the substrate. A treating fluid flows through a treating fluid supplying regulator regulating an amount of the treating fluid before dispensed onto the substrate. The treating fluid is heated to a set temperature or more by a first heater before passing through the treating fluid supplying regulator, and the treating fluid is heated by a second heater when the treating fluid is passed through the treating fluid supplying regulator. The temperature of the treating fluid is lowered in rear region of the treating fluid supplying regulator. The set temperature is a temperature that allows the lowered temperature to be maintained at a critical temperature or more.

公开(公告)号：US20220013393A1

公开(公告)日：2022-01-13

申请号：US17365165

申请日：2021-07-01

Applicant: SEMES CO., LTD.

Inventor： JINWOO JUNG ,  YONG HEE LEE

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

Abstract: An apparatus for treating a substrate is provided. The apparatus for treating the substrate includes a first process chamber to perform a liquid treatment process with respect to the substrate, a second process chamber to perform a drying treatment process with respect to the substrate which is liquid treated in the first process chamber, a first hand to introduce the substrate to the first process chamber, before the liquid treatment process is performed, a second hand to withdraw the substrate from the first process chamber after the liquid treatment process is performed and to introduce the substrate into the second process chamber, and a third hand to withdraw the substrate from the second process chamber after the drying treatment process is performed.

公开(公告)号：US20200027724A1

公开(公告)日：2020-01-23

申请号：US16516905

申请日：2019-07-19

Applicant: SEMES CO., LTD.

Inventor： JINWOO JUNG ,  YOUNG HUN LEE ,  YONG HEE LEE ,  EUI SANG LIM

IPC: H01L21/02 ,  F26B3/02 ,  F26B21/14 ,  H01L21/67

Abstract: An apparatus for treating a substrate comprises a chamber having a processing space in which a process of treating the substrate is performed and a fluid supply unit that supplies a treating fluid into the chamber. The fluid supply unit comprises a supply line, at least one orifice provided in the supply line, and a first heater provided on the orifice or upstream of the orifice. The first heater heats the treating fluid passing through the orifice to a set temperature or more.

公开(公告)号：US20210005470A1

公开(公告)日：2021-01-07

申请号：US17026389

申请日：2020-09-21

Applicant: SEMES CO., LTD.

Inventor： YONG HEE LEE ,  YOUNG HUN LEE ,  JINWOO JUNG ,  EUI SANG LIM

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US20190164787A1

公开(公告)日：2019-05-30

申请号：US16197458

申请日：2018-11-21

Applicant: SEMES CO., LTD.

Inventor： YONG HEE LEE ,  YOUNG HUN LEE ,  JINWOO JUNG ,  EUI SANG LIM

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.