APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF CLEANING SAME

    公开(公告)号:US20210074557A1

    公开(公告)日:2021-03-11

    申请号:US16952629

    申请日:2020-11-19

    Abstract: Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.

    APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF CLEANING SAME

    公开(公告)号:US20170338132A1

    公开(公告)日:2017-11-23

    申请号:US15671848

    申请日:2017-08-08

    CPC classification number: H01L21/67051

    Abstract: Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.

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