公开(公告)号：US20180316083A1

公开(公告)日：2018-11-01

申请号：US15680515

申请日：2017-08-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jui-Feng Chen ,  Chia-Cheng Hsu ,  Wen-Jung Tsai ,  Chia-Cheng Chen ,  Cheng Kai Chang

IPC: H01Q1/22 ,  H01L23/498 ,  H01L23/66 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L23/481 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01Q1/2283 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.

公开(公告)号：US20220093518A1

公开(公告)日：2022-03-24

申请号：US17108399

申请日：2020-12-01

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Cheng Kai Chang ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L23/538 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00

Abstract: An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate. Therefore, the first electronic component can be designed as a System on a Chip (SoC) with a smaller size to improve the process yield.

公开(公告)号：US10431535B2

公开(公告)日：2019-10-01

申请号：US15680515

申请日：2017-08-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jui-Feng Chen ,  Chia-Cheng Hsu ,  Wen-Jung Tsai ,  Chia-Cheng Chen ,  Cheng Kai Chang

IPC: H01L21/44 ,  H01L29/40 ,  H01L23/498 ,  H01L23/48 ,  H01Q1/22

Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.