公开(公告)号：US11754758B2

公开(公告)日：2023-09-12

申请号：US17482237

申请日：2021-09-22

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Vincent Farys ,  Alain Inard ,  Olivier Noblanc

IPC: G02B5/02 ,  C23C16/34 ,  C23C16/56 ,  C23C18/12

CPC classification number: G02B5/0263 ,  C23C16/345 ,  C23C16/56 ,  C23C18/1208 ,  G02B5/0236 ,  G02B5/0268

Abstract: Methods of manufacture of an optical diffuser. In one embodiment, an optical diffuser is formed by providing a wafer including a silicon slice of which an upper face is covered with a first layer made of a first material itself covered with a second layer made of a second selectively etchable material with respect to the first material. The method further includes forming openings in the second layer extending up to the first layer and filling the openings in the second layer with a third material. The method yet further includes bonding a glass substrate to the wafer on the side of its upper face and removing the silicon slice.

公开(公告)号：US11150388B2

公开(公告)日：2021-10-19

申请号：US15610150

申请日：2017-05-31

Applicant: STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Vincent Farys ,  Alain Inard ,  Olivier Noblanc

IPC: G02B5/02 ,  C23C16/34 ,  C23C16/56 ,  C23C18/12

Abstract: Methods of manufacture of an optical diffuser. In one embodiment, an optical diffuser is formed by providing a wafer including a silicon slice of which an upper face is covered with a first layer made of a first material itself covered with a second layer made of a second selectively etchable material with respect to the first material. The method further includes forming openings in the second layer extending up to the first layer and filling the openings in the second layer with a third material. The method yet further includes bonding a glass substrate to the wafer on the side of its upper face and removing the silicon slice.

公开(公告)号：US20230361151A1

公开(公告)日：2023-11-09

申请号：US18298781

申请日：2023-04-11

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Jonathan Fantuz ,  Alain Inard ,  Didier Dutartre

IPC: H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14627

Abstract: In accordance with an embodiment, a method for manufacturing an optical device on a support substrate includes: forming first microlens structures on the support substrate using a first photolithography process such that the first microlens structures are separated from one another; deforming the first microlens structures so as to give the first microlens structures a curved shape, wherein the first microlens structures are separated from one another by spacer regions after deformation; forming second microlens structures substrate using a second photolithography process such that the second microlens structures extend over the first microlens structures; and deforming the second microlens structures such that the second microlens structures have a curved form matching the curved shape of the first microlens structures and extend partly into the spacer regions between the first microlens structures.