公开(公告)号：US20160366758A1

公开(公告)日：2016-12-15

申请号：US14956512

申请日：2015-12-02

Applicant: STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS SA

Inventor： Nicolas HOTELLIER ,  François GUYADER ,  Vincent FIORI ,  Richard FOURNEL ,  Frédéric GIANESELLO

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H01L21/762 ,  H01L21/7624 ,  H01L21/764 ,  H01L24/03 ,  H01L24/05 ,  H01L29/0657 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2924/00014 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0011 ,  H01L2224/05599

Abstract: An electronic device has a rear plate that includes a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers. An electronic structure is on the substrate front layer and includes electronic components and electrical connections. The substrate rear layer includes a solid local region and a hollowed-out local region. The hollowed-out local region extends over all of the substrate rear layer. The substrate rear layer does not cover at least one local zone of the dielectric intermediate layer corresponding to the hollowed-out local region.

Abstract translation: 电子设备具有背板，其包括基板后层，基板前层和介于基板后层与前层之间的电介质中间层。 电子结构位于基板前层上，并且包括电子部件和电连接。 基板后层包括固体局部区域和中空的局部区域。 中空的局部区域在所有基板后层上延伸。 基板后层不覆盖与中空的局部区域对应的介电中间层的至少一个局部区域。