公开(公告)号：US20190355673A1

公开(公告)日：2019-11-21

申请号：US16409704

申请日：2019-05-10

Applicant: STMICROELECTRONICS (ROUSSET) SAS

Inventor： Alexandre SARAFIANOS ,  Bruno NICOLAS ,  Daniele FRONTE

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/528 ,  G01N27/04

Abstract: The disclosure concerns an electronic chip including a resistive region and a first switch of selection of a first area in contact with the resistive region.

公开(公告)号：US20190244915A1

公开(公告)日：2019-08-08

申请号：US16267573

申请日：2019-02-05

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Alexandre SARAFIANOS ,  Bruno NICOLAS ,  Daniele FRONTE

IPC: H01L23/00 ,  G06F21/75 ,  G06F21/77

CPC classification number: H01L23/57 ,  G06F21/75 ,  G06F21/77 ,  G06K19/07372 ,  H01L23/576

Abstract: A semiconductor substrate of an integrated circuit is protected by a coating. The semiconductor includes a front face and a rear face. To detect a breach of the integrity of a semiconductor substrate of an integrated circuit from the rear face, an opening of the coating facing the rear face of the substrate is detected. In response thereto, an alarm is generated. The detection is performed by making resistance measurements with respect to the semiconductor substrate and comparing the measured resistance to a nominal resistive value of the semiconductor substrate.