公开(公告)号：US20230411271A1

公开(公告)日：2023-12-21

申请号：US18207954

申请日：2023-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Luc PETIT ,  Jerome LOPEZ ,  Karine SAXOD

IPC: H01L23/498 ,  H01L23/367 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L23/3675 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/32245 ,  H01L24/32 ,  H01L2224/1413 ,  H01L2224/16225 ,  H01L24/73 ,  H01L2224/73253

Abstract: An electronic device includes an electronic chip located between a cover and an interconnection substrate. The electronic chip has contact pads located in front of a first surface of the interconnection substrate. At least one metal region (for example extending on the front surface) thermally couples at least one contact pad of the electronic chip to the cover.