公开(公告)号：US20220029034A1

公开(公告)日：2022-01-27

申请号：US17495606

申请日：2021-10-06

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Veronique FERRE ,  Agnes BAFFERT ,  Jean-Michel RIVIERE

IPC: H01L31/0203 ,  H01L21/56 ,  H01L31/0232 ,  H01L31/16

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

公开(公告)号：US20190267349A1

公开(公告)日：2019-08-29

申请号：US16282594

申请日：2019-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marie-Astrid PIN ,  Karine SAXOD ,  Jean-Michel RIVIERE

IPC: H01L23/00 ,  H01L31/0203 ,  H01L33/48 ,  H01L21/78

Abstract: Individual electronic units are formed by cutting a collective assembly. A collective support plate is provided which includes electronic chips. A collective cover plate is provided which includes ribs defining recesses. The collective assembly is formed by mounting the collective cover plate to the collective support plate in a manner where the electronic chips are located in the recesses and the ribs are located between electronic chips. A bead of glue is interposed between ends of the ribs and the surface of the collective support plate. After the glue is hardened, a cutting operation is performed on the collective assembly by cutting through the ribs and the collective support plate to produce the individual electronic units.

公开(公告)号：US20190103368A1

公开(公告)日：2019-04-04

申请号：US16208038

申请日：2018-12-03

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Marika SORRIEUL

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L27/146 ,  H01L25/065 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L23/48

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US20230411271A1

公开(公告)日：2023-12-21

申请号：US18207954

申请日：2023-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Luc PETIT ,  Jerome LOPEZ ,  Karine SAXOD

IPC: H01L23/498 ,  H01L23/367 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L23/3675 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/32245 ,  H01L24/32 ,  H01L2224/1413 ,  H01L2224/16225 ,  H01L24/73 ,  H01L2224/73253

Abstract: An electronic device includes an electronic chip located between a cover and an interconnection substrate. The electronic chip has contact pads located in front of a first surface of the interconnection substrate. At least one metal region (for example extending on the front surface) thermally couples at least one contact pad of the electronic chip to the cover.

公开(公告)号：US20230402745A1

公开(公告)日：2023-12-14

申请号：US18205729

申请日：2023-06-05

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Florian PERMINJAT ,  Karine SAXOD

IPC: H01Q1/38 ,  H01Q1/36 ,  H01Q21/06

CPC classification number: H01Q1/38 ,  H01Q1/364 ,  H01Q21/061

Abstract: An electronic device integrates an antenna. To fabricate such an electronic device, first antenna elements are formed on a first surface of a first substrate. The first substrate is then diced to form antenna chips. Each antenna chip includes, on a first surface corresponding to the first surface of the first substrate, one of the first antenna elements. One of the antenna chips is then bonded onto a transfer substrate. This bonding is made between a second surface of the antenna chip, orthogonal to its first surface, and an upper surface of the transfer substrate.

公开(公告)号：US20210159985A1

公开(公告)日：2021-05-27

申请号：US17169010

申请日：2021-02-05

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel RIVIERE ,  Romain COFFY ,  Karine SAXOD

IPC: H04B10/40 ,  H05K7/02 ,  H05K5/03 ,  H04B10/80 ,  H01L31/16 ,  H01L31/0203

Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.

公开(公告)号：US20210143294A1

公开(公告)日：2021-05-13

申请号：US17090461

申请日：2020-11-05

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Nicolas MASTROMAURO

IPC: H01L31/14 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/00 ,  H01L31/18 ,  G01S7/4865 ,  G01S7/484

Abstract: A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.

公开(公告)号：US20200020815A1

公开(公告)日：2020-01-16

申请号：US16581978

申请日：2019-09-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  B29C45/14 ,  H01L31/12 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20190190606A1

公开(公告)日：2019-06-20

申请号：US16218948

申请日：2018-12-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel RIVIERE ,  Romain COFFY ,  Karine SAXOD

IPC: H04B10/40 ,  H04B10/80 ,  H05K5/03 ,  H05K7/02

CPC classification number: H04B10/40 ,  H01L31/0203 ,  H01L31/162 ,  H04B10/80 ,  H05K5/03 ,  H05K7/02

Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.

公开(公告)号：US20190189859A1

公开(公告)日：2019-06-20

申请号：US16218906

申请日：2018-12-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel RIVIERE ,  Romain COFFY ,  Karine SAXOD

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/58 ,  H01L31/18 ,  H01L31/12 ,  H01L31/0232 ,  H01L31/0203 ,  H05K5/03

CPC classification number: H01L33/483 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/162 ,  H01L31/18 ,  H01L33/005 ,  H01L33/58 ,  H05K5/03

Abstract: A cover for an electronic circuit package, including an element having peripheral portions housed in an inner groove of a through opening.