公开(公告)号：US20040159927A1

公开(公告)日：2004-08-19

申请号：US10712981

申请日：2003-11-13

Applicant: STMicroelectronics Asia Pacific Pte Ltd

Inventor： Kum-Weng Loo ,  Chek-Lim Kho

IPC: H01L023/02

CPC classification number: B81C1/00269 ,  G01L19/143 ,  H01L23/04 ,  H01L23/3135 ,  H01L23/473 ,  H01L24/97 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor package having a substrate; a semiconductor die attached to the substrate; a housing attached to the substrate and arranged to surround the semiconductor die; and solidified molding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.

Abstract translation: 一种具有衬底的半导体封装; 附着在基板上的半导体管芯; 壳体，其附接到所述基板并且布置成围绕所述半导体管芯; 以及固化的模制材料，其布置在壳体周围并且附着到基板上以将壳体固定在基板上的适当位置。 还公开了制造封装的方法。