公开(公告)号：US20240205611A1

公开(公告)日：2024-06-20

申请号：US18066148

申请日：2022-12-14

Applicant: STMicroelectronics International N.V.

Inventor： Domenico GIUSTI ,  Fabio QUAGLIA ,  Marco FERRERA ,  Carlo Luigi PRELINI

IPC: H04R17/00

CPC classification number: H04R17/00

Abstract: The present disclosure is directed to transducer assemblies or device in which one or more buried cavities are present within a substrate and define or form one or more membranes along a surface of the substrate. One or more piezoelectric actuators are formed on the one or more membranes and the one or more piezoelectric actuators drive the membranes at an operating frequency with an operating bandwidth of the transducer assemblies. Each of the one or more membranes is anchored at respective portions to a main body portion of the substrate to provide robust and strong anchoring of each of the one or more membranes to push unwanted flexure modes outside the operating bandwidth of the transducer assemblies.

公开(公告)号：US20240327203A1

公开(公告)日：2024-10-03

申请号：US18613746

申请日：2024-03-22

Applicant: STMicroelectronics International N.V.

Inventor： Mark Andrew SHAW ,  Fabio QUAGLIA ,  Domenico GIUSTI ,  Marco FERRERA

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00 ,  H01L25/18 ,  H10N39/00

CPC classification number: B81B7/007 ,  B81B3/007 ,  B81C1/00301 ,  B81C1/00658 ,  H01L25/18 ,  H10N39/00 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/096 ,  B81C2203/0792

Abstract: A method for manufacturing a MEMS device includes forming a first solid body by forming, on a substrate, a layered structure having a thickness of a value comprised between 4 and 10 μm, with the layered structure having a first surface that is uniformly flat or planar throughout the extension thereof that faces the substrate. The method further includes forming, on a second surface of the layered structure opposite to the first surface in a direction, multiple transducer devices. The method then proceeds with coupling the first solid body to a supporting structure, and completely removing the substrate to expose said uniformly flat or planar surface.

公开(公告)号：US20240269708A1

公开(公告)日：2024-08-15

申请号：US18107893

申请日：2023-02-09

Applicant: STMicroelectronics International N.V.

Inventor： Domenico GIUSTI ,  Marco FERRERA ,  Fabio QUAGLIA

IPC: B06B1/06 ,  H10N30/20 ,  H10N30/30 ,  H10N30/50

CPC classification number: B06B1/0622 ,  B06B1/0666 ,  H10N30/2047 ,  H10N30/308 ,  H10N30/50 ,  B06B1/0215

Abstract: Disclosed herein is an array of ultrasound devices. Each ultrasound device includes a first piezoelectric stack carried by a membrane and forming, together with the membrane, a first piezoelectric micromachined ultrasonic transducer (PMUT), and a plurality of second piezoelectric stacks carried by the membrane and positioned about a periphery thereof, each second piezoelectric stack forming, together with the membrane, a second PMUT. During operation, the first piezoelectric stack is configured to vibrate the membrane in response to application of an alternating voltage to the first piezoelectric stack to thereby generate at least one outgoing ultrasonic pulse toward a target, and during operation, the plurality of second piezoelectric stacks are configured to generate sense voltages in response to bending thereof induced by vibration of the membrane by incoming ultrasonic reflections off the target.

公开(公告)号：US20240272298A1

公开(公告)日：2024-08-15

申请号：US18107814

申请日：2023-02-09

Applicant: STMicroelectronics International N.V.

Inventor： Domenico GIUSTI ,  Marco FERRERA ,  Fabio QUAGLIA

IPC: G01S15/89

CPC classification number: G01S15/8927 ,  B81B2203/0315 ,  B81B2207/092

Abstract: An array of piezoelectric micromachined ultrasound transducers (PMUTs) includes a substrate having first and second cavities buried therein. A first piezoelectric stack is carried by the substrate and at least partially overlays the first cavity. A second piezoelectric stack is carried by the substrate and at least partially overlays the second cavity. A thickness of the substrate between the second cavity and the second piezoelectric stack forms a membrane. Circuitry operates the second piezoelectric stack so as to vibrate the membrane to generate a pulse of ultrasound and to immediately subsequently operate the first piezoelectric stack to cause deformation of the second cavity which results in an increase in a resonant frequency of the membrane.