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公开(公告)号：US11675186B2
公开(公告)日：2023-06-13
申请号：US16591854
申请日：2019-10-03
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Sonia Costantini , Federico Vercesi , Roberto Carminati
CPC classification number: G02B26/105 , B81C1/00317 , B81C1/00523 , G02B26/0833 , B81B2201/042 , B81C2203/0109 , B81C2203/019
Abstract: A method for making a micro-electro mechanical (MEMS) device includes forming a MEMS mirror stack on a handle layer, and applying a first bonding layer to the MEMS mirror stack. The method continues with disposing a substrate on the first bonding layer such that the MEMS mirror stack is mechanically anchored to the substrate and so as to seal against ingress of environmental contaminants, removing the handle layer, and applying a second bonding layer to the MEMS mirror stack. A cap layer is disposed on the second bonding layer such that the cap layer is mechanically anchored to the MEMS mirror stack and so as to seal against ingress of environmental contaminants.
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2.发明申请公开(公告)号：US20180180871A1
公开(公告)日：2018-06-28
申请号：US15603614
申请日：2017-05-24
Applicant: STMicroelectronics S.r.l.
Inventor： Sonia Costantini , Marta Carminati , Daniela Angela Luisa Gatti , Laura Maria Castoldi , Roberto Carminati
CPC classification number: G02B26/0833 , B81B3/0083 , B81B2201/032 , B81B2201/042 , B81B2203/0307 , B81B2203/058 , B81C1/00714 , B81C2203/032 , G02B26/105
Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.
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公开(公告)号：US20180157030A1
公开(公告)日：2018-06-07
申请号：US15887557
申请日：2018-02-02
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
CPC classification number: G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
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4.发明申请公开(公告)号：US20190120710A1
公开(公告)日：2019-04-25
申请号：US16220498
申请日：2018-12-14
Applicant: STMicroelectronics S.R.L.
Inventor： Enri Duqi , Sebastiano Conti , Sonia Costantini
Abstract: A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.
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公开(公告)号：US09921405B2
公开(公告)日：2018-03-20
申请号：US15401681
申请日：2017-01-09
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
CPC classification number: G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
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Patent Agency Ranking
公开(公告)号：US20170123202A1
公开(公告)日：2017-05-04
申请号：US15401681
申请日：2017-01-09
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
CPC classification number: G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
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7.发明申请公开(公告)号：US20150168715A1
公开(公告)日：2015-06-18
申请号：US14564237
申请日：2014-12-09
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
CPC classification number: G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
Abstract translation: 静电驱动的振荡结构包括第一定子子区域，第二定子子区域，第一转子子区域和第二转子子区域。 安装到第一和第二转子子区域上的扭转弹性元件限定了旋转轴线。 移动元件联接到扭转弹性元件。 定子子区域静电耦合到移动元件上的各个致动区域。 定子子区域呈现结构不对称的元件，使得第一定子子区域和第一致动区域之间的静电耦合表面与第二定子子区域和第二致动区域之间的静电耦合表面不同。
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公开(公告)号：US10809140B2
公开(公告)日：2020-10-20
申请号：US14980373
申请日：2015-12-28
Applicant: STMicroelectronics S.R.L.
Inventor： Enri Duqi , Sebastiano Conti , Sonia Costantini
Abstract: A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.
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公开(公告)号：US10746982B2
公开(公告)日：2020-08-18
申请号：US15887557
申请日：2018-02-02
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
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公开(公告)号：US10649202B2
公开(公告)日：2020-05-12
申请号：US16225881
申请日：2018-12-19
Applicant: STMicroelectronics S.r.l.
Inventor： Sonia Costantini , Marta Carminati , Daniela Angela Luisa Gatti , Laura Maria Castoldi , Roberto Carminati
Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.
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