公开(公告)号：US20030143773A1

公开(公告)日：2003-07-31

申请号：US10293980

申请日：2002-11-12

Applicant: STMicroelectronics S.r.I.

Inventor： Simone Sassolini ,  Marco Del Sarto ,  Giovanni Frezza ,  Lorenzo Baldo

IPC: H01L021/00 ,  H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: B81C1/00333

Abstract: A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body of semiconductor material, at least one microstructure having at least one first portion and one second portion which are relatively mobile with respect to one another and are separated from one another by at least one gap region, which is accessible through a face of the body; and sealing the gap. The sealing step includes depositing on the face of the body a layer of protective material, in such a way as to close the gap region, the protective layer being such as to enable relative motion between the first portion and the second portion of the microstructure.

Abstract translation: 一种用于制造整合受保护微结构的器件的方法，包括以下步骤：在半导体材料体中形成至少一个具有至少一个第一部分和一个第二部分的微结构，所述第一部分和第二部分相对于彼此相对移动， 通过至少一个间隙区域彼此分离，所述间隙区域可通过身体的面部接近; 并密封间隙。 所述密封步骤包括在所述主体的表面上沉积一层保护材料，以使得所述间隙区域闭合，所述保护层能够使所述微结构的第一部分和第二部分之间相对运动。

公开(公告)号：US20020070464A1

公开(公告)日：2002-06-13

申请号：US09997995

申请日：2001-11-30

Applicant: STMicroelectronics S.r.I.

Inventor： Giovanni Frezza

IPC: H01L023/29

CPC classification number: H01L21/565 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00

Abstract: A method for forming by molding a plastic protective package for an electronic integrated circuit that includes an electronic device activated from the outside of said protective package. The method includes: dispensing a covering layer of elastic material on a portion of said electronic device; shaping said covering layer to form a projecting portion from a surface of said electronic device; molding said electronic integrated circuit in said plastic protective package using a mold including at least a half-mold abutting against said projecting portion; and obtaining a hole or a window formed in alignment with said projecting portion in said protective package.

Abstract translation: 一种用于通过模制用于电子集成电路的塑料保护包装形成的方法，该电子集成电路包括从所述保护包装的外部激活的电子装置。 该方法包括：在所述电子设备的一部分上分配弹性材料的覆盖层; 成形所述覆盖层以从所述电子设备的表面形成突出部分; 使用包括至少半个模具抵靠所述突出部分的模具将所述电子集成电路模制在所述塑料保护包装中; 并且获得与所述保护包装中的所述突出部分对准形成的孔或窗口。