公开(公告)号：US20030057199A1

公开(公告)日：2003-03-27

申请号：US10128989

申请日：2002-04-22

Applicant: STMicroelectronics S.r.l.

Inventor： Flavio Villa ,  Gabriele Barlocchi ,  Manlio Gennaro Torchia ,  Ubaldo Mastromatteo

IPC: H05B003/00

CPC classification number: B01L7/525 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00828 ,  B01J2219/0086 ,  B01J2219/00873 ,  B01J2219/00961 ,  B01J2219/00986 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2300/1827 ,  B01L2300/185 ,  B01L2300/1883 ,  B01L2300/1894

Abstract: An integrated device based upon semiconductor technology, in particular a chemical microreactor, including a semiconductor body having a high-temperature operating portion and a low-temperature operating portion. The semiconductor body is provided with a thermal-insulation device including a dissipator element arranged between the high-temperature operating portion and the low-temperature operating portion. The dissipator includes a membrane connecting the high-temperature operating portion and the low-temperature operating portion, and a plurality of diaphragms that extend substantially orthogonal to the membrane and are parallel to one another.

Abstract translation: 基于半导体技术的集成器件，特别是化学微反应器，包括具有高温操作部分和低温操作部分的半导体本体。 半导体本体设置有绝热装置，其包括设置在高温操作部和低温操作部之间的耗散元件。 散热器包括连接高温操作部分和低温操作部分的膜，以及基本上垂直于膜并且彼此平行延伸的多个膜片。