公开(公告)号：US20040132059A1

公开(公告)日：2004-07-08

申请号：US10663286

申请日：2003-09-16

Applicant: STMicroelectronics S.r.l.

Inventor： Mario Scurati ,  Ubaldo Mastromatteo ,  Michele Palmieri

IPC: C12Q001/68 ,  C12M001/34

CPC classification number: G01N27/44704 ,  B01F13/0059 ,  B01L3/502715 ,  B01L7/525 ,  B01L2200/10 ,  B01L2300/0636 ,  B01L2300/0816 ,  B01L2300/0867 ,  B01L2300/0874 ,  B01L2300/1827 ,  B01L2400/0415 ,  B01L2400/0424 ,  B01L2400/049 ,  B01L2400/0677 ,  B03C5/026 ,  B03C2201/26

Abstract: An integrated device for nucleic acid analysis having a support (10) and a first tank (8) for introducing a raw biological specimen includes at least one pre-treatment channel (17), a buried amplification chamber (21), and a detection chamber (24) carried by the support (10) and in fluid connection with one another and with the tank (8). The device can be used for all types of biological analyses.

Abstract translation: 用于具有用于引入原始生物样本的支撑体（10）和第一罐（8）的用于核酸分析的集成装置包括至少一个预处理通道（17），埋置放大室（21）和检测室 （24），其由所述支撑件（10）承载并且彼此流体连接并且与所述罐（8）流体连接。 该设备可用于所有类型的生物分析。

公开(公告)号：US20030057199A1

公开(公告)日：2003-03-27

申请号：US10128989

申请日：2002-04-22

Applicant: STMicroelectronics S.r.l.

Inventor： Flavio Villa ,  Gabriele Barlocchi ,  Manlio Gennaro Torchia ,  Ubaldo Mastromatteo

IPC: H05B003/00

CPC classification number: B01L7/525 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00828 ,  B01J2219/0086 ,  B01J2219/00873 ,  B01J2219/00961 ,  B01J2219/00986 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2300/1827 ,  B01L2300/185 ,  B01L2300/1883 ,  B01L2300/1894

Abstract: An integrated device based upon semiconductor technology, in particular a chemical microreactor, including a semiconductor body having a high-temperature operating portion and a low-temperature operating portion. The semiconductor body is provided with a thermal-insulation device including a dissipator element arranged between the high-temperature operating portion and the low-temperature operating portion. The dissipator includes a membrane connecting the high-temperature operating portion and the low-temperature operating portion, and a plurality of diaphragms that extend substantially orthogonal to the membrane and are parallel to one another.

Abstract translation: 基于半导体技术的集成器件，特别是化学微反应器，包括具有高温操作部分和低温操作部分的半导体本体。 半导体本体设置有绝热装置，其包括设置在高温操作部和低温操作部之间的耗散元件。 散热器包括连接高温操作部分和低温操作部分的膜，以及基本上垂直于膜并且彼此平行延伸的多个膜片。

公开(公告)号：US20040056275A1

公开(公告)日：2004-03-25

申请号：US10606660

申请日：2003-06-25

Applicant: STMicroelectronics S.r.l.

Inventor： Bruno Murari ,  Ubaldo Mastromatteo ,  Paolo Ferrari

IPC: H01L031/0328

CPC classification number: G02B27/0994

Abstract: A micromachined device made of semiconductor material is formed by: a semiconductor body; an intermediate layer set on top of the semiconductor body; and a substrate, set on top of the intermediate layer. A cavity extends in the intermediate layer and is delimited laterally by bottom fixed regions, at the top by the substrate, and at the bottom by the semiconductor body. The bottom fixed regions form fixed electrodes, which extend in the intermediate layer towards the inside of the cavity. An oscillating element is formed in the substrate above the cavity and is separated from top fixed regions through trenches, which extend throughout the thickness of the substrate. The oscillating element is formed by an oscillating platform set above the cavity, and by mobile electrodes, which extend towards the top fixed regions in a staggered way with respect to the fixed electrodes. The fixed electrodes and mobile electrodes are thus comb-fingered in plan view but formed on different levels.

Abstract translation: 由半导体材料制成的微机械加工装置由半导体本体形成， 设置在半导体本体顶部的中间层; 以及设置在中间层顶部的基板。 空腔在中间层中延伸并且由底部固定区域在顶部限定，在顶部由衬底限定，并且在底部由半导体本体限定。 底部固定区域形成固定电极，其在中间层中延伸到空腔的内部。 振荡元件形成在空腔上方的衬底中，并且通过沟槽与顶部固定区域分离，其延伸贯穿衬底的厚度。 振荡元件由设置在空腔上方的振荡平台和通过相对于固定电极以交错方式朝着顶部固定区域延伸的移动电极形成。 因此，固定电极和移动电极在平面图中梳理，但形成在不同的水平上。

公开(公告)号：US20020119597A1

公开(公告)日：2002-08-29

申请号：US10060068

申请日：2002-01-29

Applicant: STMicroelectronics S.r.l.

Inventor： Ubaldo Mastromatteo

IPC: H01L021/44

CPC classification number: B81C1/00269 ,  B81B2207/093 ,  B81C1/00301 ,  H01L21/50 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/8014 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2224/05666

Abstract: A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a second height smaller than said first height. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.

Abstract translation: 一种用于连接形成机电，流体和光学微系统的部件的两个主体的方法，其中在第一主体上形成焊接区域; 在第二主体上形成导电区域和间隔区域; 所述间隔区域在所述导电区域附近延伸并且具有小于所述第一高度的第二高度。 第一和第二主体中的一个被另一个上下颠倒，并且两个主体通过使导电区域熔化而被焊接在一起，使得它粘附到焊接区域并且塌陷，直到其高度等于间隔的高度 地区。 因此，可以相对于外界来密封活动部件或微机械结构，在接合期间自对准两个主体，获得两个主体之间的电连接，并且光学对准在两个主体上形成的两个光学结构。