公开(公告)号：US20230320175A1

公开(公告)日：2023-10-05

申请号：US18130507

申请日：2023-04-04

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ilhun SEO ,  Kyungwon PARK ,  Junho PARK ,  Woosik JUN

IPC: H10K59/80 ,  H10K59/38 ,  H10K59/122 ,  H10K59/131 ,  H10K59/12

CPC classification number: H10K59/8722 ,  H10K59/38 ,  H10K59/122 ,  H10K59/131 ,  H10K59/873 ,  H10K59/879 ,  H10K59/1201

Abstract: A display apparatus and a method of manufacturing a display apparatus are disclosed. The display apparatus includes a first substrate including a display area and a non-display area outside the display area, a pixel electrode located on the display area of the first substrate, a second substrate located over the first substrate with the pixel electrode therebetween, a sealing member located between the first substrate and the second substrate to attach the first substrate and the second substrate to each other, a metal pattern located on the first substrate to be adjacent to the sealing member at the inner side of the sealing member, and a connection wiring connected to the metal pattern and extending to an edge of the first substrate.

公开(公告)号：US20190334002A1

公开(公告)日：2019-10-31

申请号：US16273029

申请日：2019-02-11

Applicant: Samsung Display Co., Ltd.

Inventor： Ilhun SEO ,  Yun-Mo CHUNG ,  Daewoo LEE ,  Tak-Young LEE ,  Miyeon CHO

IPC: H01L29/417 ,  H01L27/32

Abstract: A thin film transistor substrate may include a base substrate, a semiconductor member, a gate electrode, a first insulation layer, and a source/drain electrode. The semiconductor member may overlap the base substrate. The gate electrode may overlap the semiconductor member and may be insulated from the semiconductor member. The first insulation layer may be positioned on the gate electrode and may include a first contact hole. The source/drain electrode may include a first discharge hole, may be electrically connected to the semiconductor member, and may be at least partially positioned inside the first contact hole. The first discharge hole may partially expose the semiconductor member.

公开(公告)号：US20190221616A1

公开(公告)日：2019-07-18

申请号：US16251262

申请日：2019-01-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yunmo CHUNG ,  Takyoung LEE ,  Ilhun SEO ,  Hojin YOON ,  Daewoo LEE

IPC: H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L27/3223 ,  H01L27/3262 ,  H01L27/3276 ,  H01L51/5012 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/56 ,  H01L2227/323

Abstract: A display apparatus and a method of manufacturing a display apparatus, the display apparatus including a first area, the first area including a structure of thin layers on a substrate; a second area, the second area including a structure of thin layers on the substrate; a planarization layer that planarizes the first area and the second area; and a step-height compensation layer, wherein the structure of thin layers of the first area is different from the structure of thin layers of the second area, the step-height compensation layer compensates for a height difference between the first area and the second area due to the different structures of thin layers, and the step-height compensation layer is between the substrate and the planarization layer and in the first area or the second area.

公开(公告)号：US20210343815A1

公开(公告)日：2021-11-04

申请号：US17025740

申请日：2020-09-18

Applicant: Samsung Display Co., Ltd.

Inventor： Ilhun SEO ,  Daewoo LEE ,  Woosik JUN ,  Yunmo CHUNG

IPC: H01L27/32

Abstract: A display apparatus includes: a lower substrate including a display area and a non-display area; a thin film transistor at the display area; a display element at the display area and electrically connected to the thin film transistor; and a discharge element at the non-display area. The discharge element includes at least one electrode layer, at least one discharge layer on the electrode layer, and at least one first insulating layer between the electrode layer and the discharge layer, and a distance from an upper surface of the lower substrate to an upper surface of the discharge layer is greater than or equal to a distance from the upper surface of the lower substrate to an upper surface of a top layer of the thin film transistor.

公开(公告)号：US20210111358A1

公开(公告)日：2021-04-15

申请号：US17126305

申请日：2020-12-18

Applicant: Samsung Display Co., Ltd.

Inventor： Ilhun SEO ,  Yunmo CHUNG ,  Jaewook KANG ,  Daewoo LEE ,  Takyoung LEE

IPC: H01L51/00 ,  H01L51/52 ,  H01L27/32

Abstract: A display device includes a substrate including a first substrate portion including a first area, a second substrate portion including a second area, and a bending area between the first substrate portion and the second substrate portion, the substrate being bendable around a bending axis that extends in a first direction, an encapsulation portion over the first substrate portion, an intermediate wiring including a first intermediate wiring portion in the first area and a second intermediate wiring portion in the second area, and a connection wiring including at least a portion in the bending area and connecting the first intermediate wiring portion to the second intermediate wiring portion.

公开(公告)号：US20200279904A1

公开(公告)日：2020-09-03

申请号：US16879661

申请日：2020-05-20

Applicant: Samsung Display Co., Ltd.

Inventor： Ilhun SEO ,  Yun-Mo CHUNG ,  Jae-Wook KANG ,  Hojin YOON ,  Daewoo LEE ,  Minseong YI ,  Tak-Young LEE ,  Miyeon CHO

IPC: H01L27/32 ,  H01L27/12

Abstract: A unit pixel includes a circuit structure, first and second wiring patterns, an interlayer insulating layer, a planarization layer, and a light emission structure. The first wiring pattern disposed on the circuit structure has a first bump structure. The interlayer insulating layer covers the circuit structure and the first wiring pattern. The second wiring pattern disposed on the interlayer insulating layer overlaps the first wiring pattern and has a second bump structure. The planarization layer covers the interlayer insulating layer and the second wiring pattern and includes a via-hole exposing at least a portion of the second wiring pattern. The light emission structure contacts the second wiring pattern through the via-hole. The first and second wiring patterns and the interlayer insulating layer form a capacitor, the light emission structure includes an OLED, and the capacitor is directly connected to an anode of the OLED.

公开(公告)号：US20180366530A1

公开(公告)日：2018-12-20

申请号：US15960111

申请日：2018-04-23

Applicant: Samsung Display Co., Ltd.

Inventor： Ilhun SEO ,  Yun-Mo CHUNG ,  Jae-Wook KANG ,  Hojin YOON ,  Daewoo LEE ,  Minseong YI ,  Tak-Young LEE ,  Miyeon CHO

IPC: H01L27/32

Abstract: A unit pixel includes a circuit structure, first and second wiring patterns, an interlayer insulating layer, a planarization layer, and a light emission structure. The first wiring pattern disposed on the circuit structure has a first bump structure. The interlayer insulating layer covers the circuit structure and the first wiring pattern. The second wiring pattern disposed on the interlayer insulating layer overlaps the first wiring pattern and has a second bump structure. The planarization layer covers the interlayer insulating layer and the second wiring pattern and includes a via-hole exposing at least a portion of be second wiring pattern. The light emission structure contacts the second wiring pattern through the via-hole. The first and second wiring patterns and the interlayer insulating layer form a capacitor, the light emission structure includes an OLED, and the capacitor is directly connected to an anode of the OLED.

公开(公告)号：US20180074361A1

公开(公告)日：2018-03-15

申请号：US15682472

申请日：2017-08-21

Applicant: Samsung Display Co., Ltd.

Inventor： Yun-mo CHUNG ,  Ilhun SEO ,  Hojin YOON ,  Daewoo LEE ,  Minseong Yi ,  Miyeon CHO

IPC: G02F1/1333 ,  H05K5/02 ,  F21V33/00

CPC classification number: G02F1/133308 ,  F21V33/0052 ,  G02F1/133305 ,  G02F1/13336 ,  G02F1/13452 ,  G02F2001/13332 ,  H05K5/02

Abstract: A display device includes a display panel and at least one electronic component connected to the display panel. The display panel includes a display area and a non-display area disposed around the display area on a plane. The non-display area has a first bending line and a second bending line intersecting the first bending line. The display panel includes a circuit layer and a display element layer including display elements. The circuit layer is disposed in the display area, disposed on a different layer than pixel circuits, and electrically connects the at least electronic component and the driving circuit.

公开(公告)号：US20180068919A1

公开(公告)日：2018-03-08

申请号：US15608550

申请日：2017-05-30

Applicant: Samsung Display Co., Ltd.

Inventor： Yunmo CHUNG ,  Ilhun SEO ,  Hojin YOON ,  Daewoo LEE ,  Minseong YI ,  Miyeon CHO

IPC: H01L23/31 ,  H01L23/538 ,  G09G3/36 ,  H01L23/482 ,  H01L27/02

CPC classification number: H01L23/31 ,  G09G3/3685 ,  H01L23/4824 ,  H01L23/5387 ,  H01L27/0248 ,  H01L27/3276 ,  H01L51/5253

Abstract: Provided is a display apparatus capable of minimizing defect occurrences during manufacturing of the display apparatus while securing a long lifespan of the display apparatus. The display apparatus includes a substrate comprising a bent area between a first area and a second area and bent about a bending axis, display devices on the first area, a scan driving circuit unit on the second area, a first encapsulation layer configured to cover the display devices, and a second encapsulation layer apart from the first encapsulation layer and configured to cover the scan driving circuit unit.

公开(公告)号：US20200091446A1

公开(公告)日：2020-03-19

申请号：US16456519

申请日：2019-06-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ilhun SEO ,  Yunmo CHUNG ,  Jaewook KANG ,  Daewoo LEE ,  Takyoung LEE

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/52

Abstract: A display device includes a substrate including a first substrate portion including a first area, a second substrate portion including a second area, and a bending area between the first substrate portion and the second substrate portion, the substrate being bendable around a bending axis that extends in a first direction, an encapsulation portion over the first substrate portion, a seal portion between the first substrate portion and the encapsulation portion to bond the first substrate portion to the encapsulation portion, an intermediate wiring including a first intermediate wiring portion in the first area and a second intermediate wiring portion in the second area, the intermediate wiring being covered by at least one inorganic layer, and a connection wiring including at least a portion in the bending area and connecting the first intermediate wiring portion to the second intermediate wiring portion.