DISPLAY DEVICE
    1.
    发明申请

    公开(公告)号:US20210217841A1

    公开(公告)日:2021-07-15

    申请号:US17036838

    申请日:2020-09-29

    IPC分类号: H01L27/32 H01L51/52

    摘要: A display device includes a base layer including an active area and a peripheral area outside the active area, a circuit element layer including a pixel in the active area of the base layer, a light emitting element layer including light emitting elements on the circuit element layer, a thin film encapsulation layer covering the light emitting element layer and including an organic layer, and an input detection layer on the thin film encapsulation layer and including a detection electrode and a detection wire connected to the detection electrode. The circuit element layer includes a connection wire overlapping the detection wire in the peripheral area, and a contact part to connect the detection wire and the connection wire in the peripheral area. The contact part is spaced apart from the organic layer of the thin film encapsulation layer on a plane.

    UNIT PIXEL AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20200279904A1

    公开(公告)日:2020-09-03

    申请号:US16879661

    申请日:2020-05-20

    IPC分类号: H01L27/32 H01L27/12

    摘要: A unit pixel includes a circuit structure, first and second wiring patterns, an interlayer insulating layer, a planarization layer, and a light emission structure. The first wiring pattern disposed on the circuit structure has a first bump structure. The interlayer insulating layer covers the circuit structure and the first wiring pattern. The second wiring pattern disposed on the interlayer insulating layer overlaps the first wiring pattern and has a second bump structure. The planarization layer covers the interlayer insulating layer and the second wiring pattern and includes a via-hole exposing at least a portion of the second wiring pattern. The light emission structure contacts the second wiring pattern through the via-hole. The first and second wiring patterns and the interlayer insulating layer form a capacitor, the light emission structure includes an OLED, and the capacitor is directly connected to an anode of the OLED.

    DISPLAY DEVICE
    4.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20180076415A1

    公开(公告)日:2018-03-15

    申请号:US15661640

    申请日:2017-07-27

    IPC分类号: H01L51/52 H01L27/32 H01L51/00

    摘要: A display device includes a display panel, and a protective member disposed outside the display panel. The circuit layer includes a display area and a non-display area, and a first bending line and a second bending line crossing the first bending line are defined are defined in the non-display area. The non-display area includes: a first non-display area bent from the display area with respect to the first bending line; a second non-display area bent from the display area with respect to the second bending line; and a corner non-display area bent from the second non-display area with respect to the first bending line and bent from the first non-display area with respect to the second bending line. A slit is defined in the protective member, and the slit overlap at least a part of the first bending line and the second bending line.

    UNIT PIXEL AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20180366530A1

    公开(公告)日:2018-12-20

    申请号:US15960111

    申请日:2018-04-23

    IPC分类号: H01L27/32

    摘要: A unit pixel includes a circuit structure, first and second wiring patterns, an interlayer insulating layer, a planarization layer, and a light emission structure. The first wiring pattern disposed on the circuit structure has a first bump structure. The interlayer insulating layer covers the circuit structure and the first wiring pattern. The second wiring pattern disposed on the interlayer insulating layer overlaps the first wiring pattern and has a second bump structure. The planarization layer covers the interlayer insulating layer and the second wiring pattern and includes a via-hole exposing at least a portion of be second wiring pattern. The light emission structure contacts the second wiring pattern through the via-hole. The first and second wiring patterns and the interlayer insulating layer form a capacitor, the light emission structure includes an OLED, and the capacitor is directly connected to an anode of the OLED.