公开(公告)号：US11203175B2

公开(公告)日：2021-12-21

申请号：US16502259

申请日：2019-07-03

Applicant: Samsung Display Co., Ltd.

Inventor： Sukju Kang ,  Byung-moo Kim ,  Geunyoung Yu

IPC: B32B3/00 ,  B32B27/00 ,  B29C65/00 ,  B32B3/04 ,  B29C65/70 ,  B29C65/48 ,  B32B27/08 ,  H05K5/00

Abstract: A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.

公开(公告)号：US10773505B2

公开(公告)日：2020-09-15

申请号：US16252677

申请日：2019-01-20

Applicant: Samsung Display Co., Ltd.

Inventor： Taejin Kim ,  Sukju Kang ,  Sangcheol Kim

IPC: B32B37/00 ,  B32B38/10 ,  B32B38/00 ,  B32B37/12 ,  B32B38/18 ,  H01L21/67 ,  H01L21/683

Abstract: A method of stably and precisely attaching substrates and an apparatus for stably and precisely attaching substrates, the method including: placing a substrate, attached with a release film, on a shuttle stage; peeling the release film from the substrate; a transferring unit lifting the substrate from the shuttle stage; a gas supplier spraying gas toward the substrate so that the substrate is convexly curved in a direction away from the gas supplier; the substrate transferred into a chamber by the transferring unit; placing the substrate on a main stage in the chamber; and attaching the substrate to an adherend.

公开(公告)号：US20190322092A1

公开(公告)日：2019-10-24

申请号：US16252677

申请日：2019-01-20

Applicant: Samsung Display Co., Ltd.

Inventor： Taejin KIM ,  Sukju Kang ,  Sangcheol Kim

IPC: B32B37/00 ,  B32B38/00 ,  B32B38/10

Abstract: A method of stably and precisely attaching substrates and an apparatus for stably and precisely attaching substrates, the method including: placing a substrate, attached with a release film, on a shuttle stage; peeling the release film from the substrate; a transferring unit lifting the substrate from the shuttle stage; a gas supplier spraying gas toward the substrate so that the substrate is convexly curved in a direction away from the gas supplier; the substrate transferred into a chamber by the transferring unit; placing the substrate on a main stage in the chamber; and attaching the substrate to an adherend.