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公开(公告)号:US11769547B2
公开(公告)日:2023-09-26
申请号:US17685067
申请日:2022-03-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byongmo Moon , Jihye Kim , Je Min Ryu , Beomyong Kil , Sungoh Ahn
IPC: G11C11/4076 , G11C11/4093 , G06F3/06 , G11C11/4096 , H01L25/18
CPC classification number: G11C11/4093 , G06F3/0604 , G06F3/0659 , G06F3/0679 , G11C11/4076 , G11C11/4096 , H01L25/18
Abstract: A method for using a high bandwidth memory controller includes providing a clock signal having a first clock frequency, providing a write strobe signal having a second clock frequency, providing a write command/address signal based on the clock signal, and providing a write data signal based on the write strobe signal. The first clock frequency is half of the second clock frequency, the write strobe signal has two cycles of pre-amble before the write data signal, and the write strobe signal has two cycles of post-amble after the write data signal.
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公开(公告)号:US11574670B2
公开(公告)日:2023-02-07
申请号:US17690137
申请日:2022-03-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byongmo Moon , Beomyong Kil , Jihye Kim
IPC: G11C5/14 , G11C11/4074 , G11C8/18 , G11C11/4076 , G11C11/409
Abstract: A memory device includes: first power pins in a first power area and configured to receive a first power voltage; data pins configured to transmit or receive data signals, the data pins being arranged in a first region and in a second region each including the first power area; control pins configured to transmit or receive control signals in the first region and in the second region; second power pins in a second power area between the first region and the second region and configured to receive a second power voltage different from the first power voltage; and ground pins in the second power area and configured to receive a ground voltage.
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公开(公告)号:US11599301B2
公开(公告)日:2023-03-07
申请号:US17245325
申请日:2021-04-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Haesuk Lee , Reum Oh , Youngcheon Kwon , Beomyong Kil , Jemin Ryu , Jihyun Choi
Abstract: A semiconductor memory device includes an interface semiconductor die, at least one memory semiconductor die, and through-silicon vias connecting the interface semiconductor die and the memory semiconductor die. The interface semiconductor die includes command pins to receive command signals transferred from a memory controller and an interface command decoder to decode the command signals. The memory semiconductor die includes a memory integrated circuit configured to store data and a memory command decoder to decode the command signals transferred from the interface semiconductor die. The interface semiconductor die does not include a clock enable pin to receive a clock enable signal from the memory controller. The interface and memory command decoders generate interface and memory clock enable signals to control clock supply with respect to the interface and memory semiconductor dies based on a power mode command transferred through the plurality of command pins from the memory controller.
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公开(公告)号:US11295808B2
公开(公告)日:2022-04-05
申请号:US17084345
申请日:2020-10-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byongmo Moon , Jihye Kim , Je Min Ryu , Beomyong Kil , Sungoh Ahn
IPC: G11C11/4076 , G11C11/4093 , G06F3/06 , G11C11/4096 , H01L25/18
Abstract: A memory device includes a control logic circuit, a write data strobe signal divider, a data transceiver, and a memory cell array. The control logic circuit generates a reset signal before a write data strobe signal provided from a memory controller starts to toggle. The write data strobe signal divider generates internal write data strobe signals that toggle depending on toggling of the write data strobe signal, the internal write data strobe signals toggling with different phases, respectively. The control logic circuit initializes the internal write data strobe signals to given values in response to the reset signal. The data transceiver receives write data provided from the memory controller based on the internal write data strobe signals. The memory cell array stores the received write data.
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公开(公告)号:US11309013B2
公开(公告)日:2022-04-19
申请号:US17130493
申请日:2020-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byongmo Moon , Beomyong Kil , Jihye Kim
IPC: G11C5/14 , G11C11/4074 , G11C8/18 , G11C11/4076 , G11C11/409
Abstract: A memory device includes: first power pins in a first power area and configured to receive a first power voltage; data pins configured to transmit or receive data signals, the data pins being arranged in a first region and in a second region each including the first power area; control pins configured to transmit or receive control signals in the first region and in the second region; second power pins in a second power area between the first region and the second region and configured to receive a second power voltage different from the first power voltage; and ground pins in the second power area and configured to receive a ground voltage.
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公开(公告)号:US20210225426A1
公开(公告)日:2021-07-22
申请号:US17084345
申请日:2020-10-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byongmo MOON , Jihye Kim , Je Min Ryu , Beomyong Kil , Sungoh Ahn
IPC: G11C11/4093 , H01L25/18 , G11C11/4076 , G11C11/4096 , G06F3/06
Abstract: A memory device includes a control logic circuit, a write data strobe signal divider, a data transceiver, and a memory cell array. The control logic circuit generates a reset signal before a write data strobe signal provided from a memory controller starts to toggle. The write data strobe signal divider generates internal write data strobe signals that toggle depending on toggling of the write data strobe signal, the internal write data strobe signals toggling with different phases, respectively. The control logic circuit initializes the internal write data strobe signals to given values in response to the reset signal. The data transceiver receives write data provided from the memory controller based on the internal write data strobe signals. The memory cell array stores the received write data.
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