公开(公告)号：US20250167056A1

公开(公告)日：2025-05-22

申请号：US18744964

申请日：2024-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyuhyeong KIM ,  Chaein MOON

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H01L23/498

Abstract: Provided is a semiconductor package including a substrate defining a first recess portion and a plurality of second recess portions, the plurality of second recess portions are arranged on a bottom surface of the first recess portion, a semiconductor chip in the first recess portion of the substrate, solder balls arranged in the plurality of second recess portions of the substrate and electrically connected to the semiconductor chip, and a heat dissipation structure on the substrate and the semiconductor chip, the bottom surface of the first recess portion of the substrate being on a higher level than upper surfaces of the solder balls.

公开(公告)号：US20240049400A1

公开(公告)日：2024-02-08

申请号：US18127531

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngja KIM ,  Donguk KWON ,  Youngmin LEE ,  Byungkeun KANG ,  Gongmyeong KIM ,  Chaein MOON

IPC: H05K3/34 ,  H01L23/00

CPC classification number: H05K3/3494 ,  H01L24/13 ,  H05K3/3447 ,  H01L2224/81815

Abstract: A method of manufacturing an electronic device, includes: providing a substrate including a plurality of mounting regions on which electronic components are mounted respectively; forming a plurality of vapor passage holes that penetrate the substrate; disposing the electronic components on the substrate via bumps; heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state; supplying at least a portion of the second heat transfer fluid in the vapor state through the vapor passage holes of the substrate; and soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state.