公开(公告)号：US20180359887A1

公开(公告)日：2018-12-13

申请号：US15780256

申请日：2016-12-01

申请人： Protosonic Limited

发明人： Niall Barrett

IPC分类号： H05K13/00 ,  B23K3/08

CPC分类号： H05K13/0069 ,  B23K3/087 ,  B23K2101/42 ,  H05K3/3421 ,  H05K3/3447 ,  H05K13/0053 ,  H05K2203/0173

摘要： An apparatus for holding a printed circuit board when mounting components thereon, said apparatus comprising a base plate, a mounting device for mounting a printed circuit board spaced from and substantially parallel to the base plate, a plurality of elongate support pins extending through respective holes within the base plate to extend transversely from the base plate, the support pins being independently positionable in height with respect to the base plate to define a configurable support surface for supporting components mounted on the printed circuit board during soldering, wherein the height that each pin extends from the base plate can be adjusted such that the support surface defined by the support pins can correspond to the topography of the circuit board and the components mounted thereon, a locking mechanism being provided for selectively locking the position of each support pin with respect to the base plate, wherein said locking mechanism comprises at least one elongate flexible member arranged to extend around a plurality of said support pins in convolute manner, tensioning device being associated with said at least one flexible member, whereby said tensioning device is adapted to selectively apply tension to said at least one flexible member to grip the pins around which said flexible member extends to lock the position of said pins with respect to the base plate.

公开(公告)号：US20180295721A1

公开(公告)日：2018-10-11

申请号：US15944626

申请日：2018-04-03

申请人： CANON KABUSHIKI KAISHA

发明人： Takashi Tokoro

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  H01R13/6471

CPC分类号： H05K1/0298 ,  H01R12/58 ,  H01R13/6471 ,  H05K1/0222 ,  H05K1/025 ,  H05K1/115 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/4626 ,  H05K2201/0792 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09809 ,  H05K2201/10303

摘要： Signal transmission characteristics in a case where a conductive pin is inserted into a through hole to perform connection with an external circuit are improved. A multilayer wiring substrate includes a front layer and a rear layer, and includes a plurality of layers in an inner layer. A conductive portion is provided in each of the layers, and a wiring is disposed on the rear layer. The conductive pin for connection with the external circuit is inserted into the through hole. A land is disposed around the through hole on the rear layer, and the land and the conductive pin are connected to each other through solder.

公开(公告)号：US10039192B1

公开(公告)日：2018-07-31

申请号：US15703174

申请日：2017-09-13

申请人： WIESON TECHNOLOGIES CO., LTD.

发明人： Qiang-Long Hu ,  Wen-Sheng Liu

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K3/36 ,  H01R12/59 ,  H05K1/14 ,  H05K3/34 ,  H01R12/77

CPC分类号： H05K1/189 ,  H01R12/59 ,  H01R12/61 ,  H01R12/778 ,  H01R13/6461 ,  H05K1/117 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3447 ,  H05K3/3457 ,  H05K3/363 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09327 ,  H05K2201/10189 ,  H05K2201/2009

摘要： The present disclosure illustrates an ultra-thin dual-channel flexible circuit bridge connector including a dual-channel flexible circuit board, a first connection interface and a second connection interface. The dual-channel flexible circuit board includes, in a sequential order, a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer and a fourth insulating layer. The first connection interface and the second connection interface can be used to link two extend interface cards spaced apart by various distances, thereby forming a bridge status. The ground layer between the first circuit layer and the second circuit layer can be served as a common reference plane for dual-channel high frequency signal transmission and provide shielding and isolating effect, so as to satisfy the requirement for working bandwidth to satisfy the requirement for characteristic impedance, reduce skin effect, reduce EMI and crosstalk interference.

公开(公告)号：US10015882B1

公开(公告)日：2018-07-03

申请号：US14589464

申请日：2015-01-05

申请人： TriQuint Semiconductor, Inc.

发明人： Dylan Murdock ,  Binh K. Le ,  Michael J. Arnold ,  Walid Meliane

IPC分类号： H05K5/00 ,  H05K1/18 ,  H05K5/02 ,  H05K5/06 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K1/181 ,  H01L23/057 ,  H05K1/184 ,  H05K3/306 ,  H05K3/3447 ,  H05K5/0095 ,  H05K5/0239 ,  H05K5/061 ,  H05K5/069

摘要： Embodiments described herein relate generally to a microelectronic packaging and the manufacture thereof. A carrier may have a die attached to a top face thereof. A printed circuit board may be attached to the top face of the carrier. The printed circuit board may have a hole in which the die is disposed. A lid may be attached to the printed circuit board opposite the carrier so that the die is enclosed by the carrier, the printed circuit board, and the lid. The printed circuit board may form a seal ring around the die. Other embodiments may be described and/or claimed.

公开(公告)号：US10001610B2

公开(公告)日：2018-06-19

申请号：US15366008

申请日：2016-12-01

申请人： Oclaro Japan, Inc.

发明人： Kazuhiro Komatsu ,  Daisuke Noguchi

IPC分类号： G02B6/42 ,  H05K1/02 ,  H01L31/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC分类号： G02B6/4279 ,  G02B6/4238 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4263 ,  G02B6/428 ,  H05K1/0245 ,  H05K1/111 ,  H05K1/118 ,  H05K1/181 ,  H05K3/3447 ,  H05K2201/10121

摘要： A plurality of leads include a pair of differential signal leads for inputting differential signals, and a power supply lead for supplying power. A wiring pattern includes a pair of differential transmission lines connected to the pair of differential signal leads, and a power supply wiring connected to the power supply lead. A wiring board includes a first region overlapping an optical subassembly, and a second region extending from the first region so as to protrude from the optical subassembly. The pair of differential signal leads are farther away from the second region than the power supply lead. The pair of differential transmission lines are close together so as to be electromagnetically coupled to each other. The optical subassembly does not include a lead penetrating the wiring board in a region between the pair of differential transmission lines.

公开(公告)号：US20180126474A1

公开(公告)日：2018-05-10

申请号：US15795333

申请日：2017-10-27

申请人： DENSO CORPORATION

发明人： Shinichiro SHIRAISHI ,  Mitsuhiro SUGIURA ,  Chisato OZAWA

IPC分类号： B23K1/012 ,  H05K3/34 ,  B23K1/00

CPC分类号： B23K1/012 ,  B23K1/0016 ,  B23K3/028 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/081

摘要： A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

公开(公告)号：US20180062290A1

公开(公告)日：2018-03-01

申请号：US15683051

申请日：2017-08-22

申请人： Sumitomo Wiring Systems, Ltd.

发明人： Hideki Goto

IPC分类号： H01R12/71 ,  H01R12/70

CPC分类号： H01R12/718 ,  H01R4/02 ,  H01R12/526 ,  H01R12/585 ,  H01R12/7064 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10803

摘要： Provided is a substrate terminal-equipped printed circuit board having configured to enable a substrate terminal to be fixed to a printed circuit board without using a pedestal, and to reduce the pressure and the insertion force applied to an inner surface of a through hole when the substrate terminal is press-fitted therein. A conducting portion of a substrate terminal includes: a press-fitted portion disposed at a proximal end portion thereof and is press-fitted into a through hole; and a loosely inserted portion that extends from the press-fitted portion to a distal end portion thereof, has a narrower width than the press-fitted portion, and is inserted into the through hole with a gap therebetween, and the press-fitted portion of the conducting portion is in pressure contact only with printed wiring provided on a surface layer of the printed circuit board and with an insulating layer located immediately below the printed wiring.

公开(公告)号：US20180042121A1

公开(公告)日：2018-02-08

申请号：US15657386

申请日：2017-07-24

申请人： Molex, LLC

发明人： Ze-Li XIONG

IPC分类号： H05K3/34 ,  H05K1/11

CPC分类号： H05K3/3436 ,  H05K1/111 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2203/044

摘要： A circuit board with solder thieves is provided that has a plurality of plug-in connector pads, a plurality of conductive traces, and first and second solder thieves. The plurality of plug-in connector pads are arranged in two rows on the circuit board. Each conductive trace connects with a plug-in connector pad. Both of the first solder thief and the second solder thief are provided on one side of the two rows of plug-in connector pads, the one side is away from an advancing direction of the circuit board during wave soldering. Each of an area of the first solder thief and an area of the second solder thief is greater than or equal to a sum of areas of two plug-in connector pads adjacent to corresponding one of the first solder thief and the second solder thief. Sizes of the solder thieves on the circuit board with solder thieves according to the present disclosure each are large enough to form a sufficient amount of traction force during wave soldering, so it will not leave solder projections, therefore it will not cause short circuit.

公开(公告)号：US09888558B2

公开(公告)日：2018-02-06

申请号：US13152419

申请日：2011-06-03

申请人： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

发明人： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

IPC分类号： H05K1/03 ,  H05K1/02 ,  H01R12/72 ,  H05K3/36 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H05K7/10 ,  H05K1/05 ,  H05K3/20 ,  H05K3/34 ,  H05K1/14

CPC分类号： H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

摘要： A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

公开(公告)号：US20170339793A1

公开(公告)日：2017-11-23

申请号：US15669126

申请日：2017-08-04

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Etsuji Katayama ,  Jun Miyokawa ,  Maiko Ariga ,  Toshio Sugaya

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/32 ,  H05K3/40

CPC分类号： H05K1/189 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/32 ,  H05K3/3447 ,  H05K3/363 ,  H05K3/366 ,  H05K3/40 ,  H05K3/4015 ,  H05K2201/053 ,  H05K2201/09618 ,  H05K2201/10121 ,  H05K2201/10303

摘要： A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.