公开(公告)号：US20190141444A1

公开(公告)日：2019-05-09

申请号：US16182743

申请日：2018-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daegi LEE ,  Daegyu KANG ,  Seokhyun MUN ,  Yongwook PARK ,  Hyunmin OH

IPC: H04R3/00 ,  H04R1/40 ,  G10L25/51

Abstract: Certain embodiments of the present disclosure are related to an apparatus and a method for executing a function corresponding to pattern data generated using a plurality of microphones. An electronic device may include a plurality of microphones and a processor. The processor may be configured to detect a user input at the plurality of the microphones, to generate pattern data based on the user input, and to execute a function corresponding to the pattern data.

公开(公告)号：US20210321540A1

公开(公告)日：2021-10-14

申请号：US17266355

申请日：2019-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunmin OH ,  Sungjin PARK ,  Daegyu KANG ,  Insu KIM ,  Daegi LEE ,  Jonghyun LEE

IPC: H05K7/20 ,  H04R1/02 ,  H04R9/02

Abstract: An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.

公开(公告)号：US20190250678A1

公开(公告)日：2019-08-15

申请号：US16276406

申请日：2019-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hankon KIM ,  Jinchul CHOI ,  Sangwoo YU ,  Heeseung CHOI ,  Daegi LEE

IPC: G06F1/16 ,  H01Q1/24 ,  G06F9/30 ,  G06F3/0484 ,  G06F3/0354

CPC classification number: G06F1/1698 ,  G06F3/03547 ,  G06F3/04847 ,  G06F9/3004 ,  H01Q1/243

Abstract: An electromagnetic wave sensing electronic device includes: a communication module configured to communicate with an external electronic device; at least one electromagnetic wave reception antenna configured to detect an electromagnetic signal generated from the external electronic device; a memory; and at least one processor, wherein the memory stores instructions causing the processor to, when executed, receive the electromagnetic signal, when the received electromagnetic signal has a predetermined range intensity or a predetermined range frequency characteristic, analyze the received electromagnetic signal, identify the external electronic device, based at least on the analysis result, identify a type of the electromagnetic signal, based at least one the analysis result, determine a proximity location between the electronic device and the external electronic device, based at least on the identified type of the electromagnetic signal, identify one or more predetermined functions corresponding to the determined proximity location, and perform the one or more predetermined functions.