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Patent Agency Ranking
公开(公告)号：US09459414B2
公开(公告)日：2016-10-04
申请号：US14163355
申请日：2014-01-24
Applicant: Samsung Electronics Co., Ltd
Inventor： Sung-Dong Suh , Kyoung-Won Na , Yoon-Dong Park , Beom-Suk Lee , Dong-Mo Im
IPC: G02B6/32 , G02B6/42 , H01L31/167
CPC classification number: G02B6/4206 , H01L31/167
Abstract: An optical coupling system is provided which includes a first layer structure and a second layer structure. The first layer structure includes a plurality of layers sequentially stacked on a substrate, and is configured to compresses a beam emitted from a light source along a direction substantially perpendicular to a top surface of the substrate. The second layer structure is formed on the substrate, and is configured to compresses the beam, having passed through the first layer structure, along a direction substantially parallel to the top surface of the substrate.
Abstract translation: 提供一种光耦合系统，其包括第一层结构和第二层结构。 第一层结构包括顺序地堆叠在基板上的多个层，并且被配置为沿着基本上垂直于基板的顶表面的方向压缩从光源发射的光束。 第二层结构形成在基板上，并且被构造成沿着基本上平行于基板的顶表面的方向压缩已经穿过第一层结构的梁。
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公开(公告)号：US11284028B2
公开(公告)日：2022-03-22
申请号：US16950122
申请日：2020-11-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae-Yon Lee , Gwi-Deok Ryan Lee , Masaru Ishii , Dong-Mo Im
Abstract: An image sensor includes a first sensor pixel and a second sensor pixel that vertically overlap each other. The first sensor pixel includes a first signal generation circuit, and a first photoelectric converter that is connected to the first signal generation circuit and configured to generate first information from light having a first wavelength. The second sensor pixel includes a second signal generation circuit, and a second photoelectric converter that is connected to the second signal generation circuit and configured to generate second information from light having a second wavelength. A first horizontal surface area of the first photoelectric converter is different from a second horizontal surface area of the second photoelectric converter. An image sensor module includes the image sensor, a light source configured to emit light to a target object, and a dual band pass filter configured to selectively pass light reflected from the target object.
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公开(公告)号：US20130259747A1
公开(公告)日：2013-10-03
申请号：US13754347
申请日：2013-01-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Beom Suk Lee , Kyoung-Won Na , Yoon-Dong Park , Sung-Dong Suh , Dong-Mo Im
IPC: G01N21/84
CPC classification number: G01N21/84 , G01N21/7746
Abstract: An optical biosensor includes a sensing block that receives a first optical signal and outputs a second optical signal through at least one channel of a plurality of channels that correspond to a sensed concentration of a biomaterial; and a detecting block that detects the second optical signal, converts the second optical signal into an electrical signal, and outputs the electrical signal.
Abstract translation: 光学生物传感器包括：感测块，其接收第一光信号并通过对应于生物材料的感测浓度的多个通道中的至少一个通道输出第二光信号; 以及检测块，其检测第二光信号，将第二光信号转换为电信号，并输出电信号。
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公开(公告)号：US11101327B2
公开(公告)日：2021-08-24
申请号：US16829265
申请日：2020-03-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-Mo Im , Gwi-Deok Lee , Tae-Yon Lee , Masaru Ishii
IPC: H01L27/30 , H01L27/146 , H04N5/374
Abstract: An image sensor includes a color filter on a substrate, first and second organic photodiodes on the color filter, and first and second capacitors connected to the first and second organic photodiodes, respectively. The color filter is spaced apart from a first surface of the substrate. Each of the first and second organic photodiodes face an upper surface of the color filter. The first capacitor includes a first conductive pattern and a first insulating space. The first conductive pattern extends through the substrate, and the first insulating spacer surrounds a sidewall of the first conductive pattern and has a first thickness. The second capacitor includes a second conductive pattern and a second insulating spacer. The second conductive pattern extends through the substrate, and the second insulating spacer surrounds a sidewall of the second conductive pattern and has a second thickness smaller than the first thickness.
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公开(公告)号：US20190260952A1
公开(公告)日：2019-08-22
申请号：US16239662
申请日：2019-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： TAE-YON LEE , Gwi-Deok Ryan Lee , Masaru Ishii , Dong-Mo Im
Abstract: An image sensor includes a first sensor pixel and a second sensor pixel that vertically overlap each other. The first sensor pixel includes a first signal generation circuit, and a first photoelectric converter that is connected to the first signal generation circuit and configured to generate first information from light having a first wavelength. The second sensor pixel includes a second signal generation circuit, and a second photoelectric converter that is connected to the second signal generation circuit and configured to generate second information from light having a second wavelength. A first horizontal surface area of the first photoelectric converter is different from a second horizontal surface area of the second photoelectric converter. An image sensor module includes the image sensor, a light source configured to emit light to a target object, and a dual band pass filter configured to selectively pass light reflected from the target object.
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