公开(公告)号：US12175655B2

公开(公告)日：2024-12-24

申请号：US17668622

申请日：2022-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung Yoon ,  Junghoon Kim ,  Ilsuk Park ,  Kwangil Shin

IPC: G06T7/00 ,  G06V10/14 ,  G06V10/22

Abstract: A substrate inspection method includes: (i) acquiring a plurality of defect of interest (DOI) images of a substrate having a DOI, under a corresponding plurality of different optical conditions, (ii) acquiring a plurality of DOI difference images from differences between the plurality of DOI images and a reference image, and (iii) acquiring a plurality of DOI difference-of-difference (DOD) images from differences between the plurality of DOI difference images. The method also includes setting two optical conditions corresponding to a DOI DOD image having the highest signal-to-noise ratio (SNR) among the plurality of DOI DOD images, as a first optical condition and a second optical condition, and acquiring a first image of the substrate under the first optical condition and a second image of the substrate under the second optical condition. A first difference image is also acquired, which is a difference between the first image and the reference image, and a second difference image is acquired, which is a difference between the second image and the reference image. A DOD image is acquired that is a difference between the first difference image and the second difference image. A low-SNR defect candidate region is then detected from the first difference image, the second difference image, and the DOD image.

公开(公告)号：US20170146340A1

公开(公告)日：2017-05-25

申请号：US15209137

申请日：2016-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung Yoon ,  Hyungsuk Cho

IPC: G01B11/27

CPC classification number: G01B11/272 ,  G01B11/26 ,  G06T7/73 ,  G06T2207/30148

Abstract: An alignment key pattern includes an origin alignment mark having a cross shape and a rotation angle measurement mark (RAMM) having a radial shape. The RAMM includes a plurality of radially-extending bars that are aligned to a common center point. These radially-extending bars include at least two horizontal bars, which extend horizontally and are spaced apart from each other, a vertical bar configured to be perpendicular to and spaced apart from the horizontal bars, and diagonal bars configured to have a first angle with respect to and be spaced apart from the horizontal bars and the vertical bar.

公开(公告)号：US12130242B2

公开(公告)日：2024-10-29

申请号：US18446837

申请日：2023-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Yoon ,  Jeongho Ahn ,  Dongryul Lee ,  Dongchul Ihm ,  Chungsam Jun

IPC: G01N21/95 ,  G01N21/88 ,  G01N21/956 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N21/956 ,  H01L22/12

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

公开(公告)号：US11754510B2

公开(公告)日：2023-09-12

申请号：US17501318

申请日：2021-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Yoon ,  Jeongho Ahn ,  Dongryul Lee ,  Dongchul Ihm ,  Chungsam Jun

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N21/956 ,  H01L22/12

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

公开(公告)号：US20230033089A1

公开(公告)日：2023-02-02

申请号：US17668622

申请日：2022-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung Yoon ,  Junghoon Kim ,  Ilsuk Park ,  Kwangil Shin

IPC: G06T7/00 ,  G06V10/22 ,  G06V10/14

Abstract: A substrate inspection method includes: (i) acquiring a plurality of defect of interest (DOI) images of a substrate having a DOI, under a corresponding plurality of different optical conditions, (ii) acquiring a plurality of DOI difference images from differences between the plurality of DOI images and a reference image, and (iii) acquiring a plurality of DOI difference-of-difference (DOD) images from differences between the plurality of DOI difference images. The method also includes setting two optical conditions corresponding to a DOI DOD image having the highest signal-to-noise ratio (SNR) among the plurality of DOI DOD images, as a first optical condition and a second optical condition, and acquiring a first image of the substrate under the first optical condition and a second image of the substrate under the second optical condition. A first difference image is also acquired, which is a difference between the first image and the reference image, and a second difference image is acquired, which is a difference between the second image and the reference image. A DOD image is acquired that is a difference between the first difference image and the second difference image. A low-SNR defect candidate region is then detected from the first difference image, the second difference image, and the DOD image.