公开(公告)号：US20250167031A1

公开(公告)日：2025-05-22

申请号：US18890154

申请日：2024-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hosin SONG ,  Yeongkwon KO ,  Jiyoung PARK ,  Junyeong HEO

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/68

Abstract: A carrier substrate according to some example embodiments is a carrier substrate having a circular disk shape, and includes a first surface, a second surface opposite surface to first surface, and an inclined surface that extends along the edge of the first surface, has an inclination angle from the first surface, and is configured to reflect incident light from the second surface.

公开(公告)号：US20230057061A1

公开(公告)日：2023-02-23

申请号：US17722630

申请日：2022-04-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seyeong SEOK ,  Dongwoo KIM ,  Hosin SONG ,  Jonghyeon CHANG

IPC: H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H01L23/538

Abstract: A semiconductor chip that includes a chip body that has a first side surface, a second side surface, a third side surface, and a fourth side surface; a central region at a central portion of the chip body; and a peripheral region at a peripheral portion of the chip body and adjacent to at least one of the first side surface to the fourth side surface, wherein the peripheral region includes a first unit region that includes a plurality of first bumps of a first bump density, and a second unit region that includes a plurality of second bumps of a second bump density higher than the first bump density.