公开(公告)号：US11283155B2

公开(公告)日：2022-03-22

申请号：US16440058

申请日：2019-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho Lee ,  Hyunho Baek

IPC: H01Q1/24 ,  H01Q5/30 ,  H01L23/14 ,  H01L23/48 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q23/00 ,  H01Q21/08 ,  H01Q5/42

Abstract: An electronic device and an antenna device of an electronic device are provided. The electronic device includes a wafer, a radio frequency integrated circuit (RFIC) fabricated in the wafer, an antenna interposer disposed on a surface of the wafer, an antenna structure fabricated in the antenna interposer, the antenna structure comprising a first conductive pattern with a first electrical length and a second conductive pattern with a second electrical length, a switch formed in the RFIC and electrically connected to at least one of the first conductive pattern or the second conductive pattern based on a frequency band of a signal being transmitted or received by the RFIC, and a through hole formed in at least part of the wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure.

公开(公告)号：US10180465B2

公开(公告)日：2019-01-15

申请号：US15161839

申请日：2016-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho Baek

IPC: G01R31/40 ,  G01R29/26 ,  G01R31/44

Abstract: Disclosed is an inspection apparatus for inspecting a chip for noise, including an inspection circuit that is connected to a first power line of the chip and that receives a signal to be inspected, wherein the first voltage is applied to the first power line and the signal to be inspected includes noise having a second voltage, and a voltage doubler that is connected to the first power line and boosts a voltage of driving power having the first voltage, wherein the inspection circuit may be driven by the driving power, the voltage of the driving power is boosted by the voltage doubler, and the inspection circuit inspects the chip for the noise of the signal to be inspected.