公开(公告)号：US09754658B2

公开(公告)日：2017-09-05

申请号：US15000319

申请日：2016-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Do Hyung Kim ,  In Young Park ,  Dong Yoon Seo ,  Jong Hyun Seok ,  Young Ho Lee ,  Dong Min Jang

IPC: G11C5/02 ,  G11C11/4093 ,  G11C5/04 ,  G11C5/06 ,  G11C7/02 ,  G11C11/4076

CPC classification number: G11C11/4093 ,  G11C5/04 ,  G11C5/063 ,  G11C7/02 ,  G11C11/4076

Abstract: A memory module includes a first printed circuit board (PCB) which includes a first surface, a second surface, first taps formed on the first surface, and second taps formed on the second surface, a first buffer attached to the first PCB, and first memory devices attached to the first PCB, in which the first buffer is configured to transmit signals input through the first taps and the second taps to the first memory devices, and signals re-driven by the first buffer among the signals are transmitted to a second module through the second taps.