SEMICONDUCTOR DEVICE
    2.
    发明公开

    公开(公告)号:US20240107743A1

    公开(公告)日:2024-03-28

    申请号:US17953054

    申请日:2022-09-26

    CPC classification number: H01L27/10814 H01L27/10823 H01L27/10897

    Abstract: A semiconductor device includes; a substrate including an active region including a first region and a second region, a bitline extending in a first direction on the substrate and electrically connected to the first region of the active region, a spacer structure disposed on a side surface of the bitline, a contact structure disposed on a side surface of the spacer structure and electrically connected to the second region of the active region and a data storage structure disposed on the contact structure and electrically connected to the contact structure. The contact structure includes; a conductive contact layer including a first portion and a second portion disposed on the first portion, a barrier layer surrounding the first portion of the conductive contact layer, and an air gap surrounding the second portion of the conductive contact layer.

    SEMICONDUCTOR DEVICE INCLUDING CARBON-CONTAINING CONTACT FENCE

    公开(公告)号:US20230089688A1

    公开(公告)日:2023-03-23

    申请号:US17705991

    申请日:2022-03-28

    Abstract: A semiconductor device includes; an active region defined by an isolation film on a substrate, a word line in the substrate, the word line extending in a first direction and crossing the active region, a bit line above the word line and extending in a second direction, a contact between bit lines adjacent in the first direction, the contact connecting the active region and extending in a vertical direction, and a contact fence disposed on each of opposing side surfaces of the contact in the second direction and extending in the vertical direction, wherein the active region has a bar shape extending oblique to the first direction, and the contact fence includes a carbon-containing insulating film.

Patent Agency Ranking