公开(公告)号：US20220385311A1

公开(公告)日：2022-12-01

申请号：US17885127

申请日：2022-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongryul SHIN ,  Seho KIM ,  Gyubok PARK ,  Jeongwan PARK ,  Joonbo PARK ,  Jinkyu BANG ,  Min SAKONG ,  Moonsoo SON ,  Kwanseok LEE ,  Byungman LIM ,  Sooyoung JANG

IPC: H04B1/00 ,  H01Q1/24 ,  H04B1/40

Abstract: An electronic device includes a side surface member, a wireless communication circuit, and a switch circuit. The side surface member includes a first conductive portion coupled to the wireless communication circuit and the switch circuit, a second conductive portion coupled to the switch circuit, and a first non-conductive portion disposed between the first conductive portion and the second conductive portion. The switch circuit is controlled to be in at least one of a first state, a second state, and a third state, based on a first frequency of a first operating signal supplied by the wireless communication circuit. The switch circuit is configured to couple the second conductive portion to the wireless communication circuit, in the first state, and to couple the second conductive portion to the first conductive portion, in the second state.

公开(公告)号：US20170201013A1

公开(公告)日：2017-07-13

申请号：US15375778

申请日：2016-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wowjin CHOI ,  Sungkee KIM ,  Dongryul SHIN ,  Junhyuck LEE ,  Sooyoung JANG ,  Moonhyuk CHOI ,  Kwangho KIM ,  Joonbo PARK ,  Hanjae BAE ,  Seunghun SHIN ,  Chulhyung YANG ,  Jiwoo LEE

IPC: H01Q1/24 ,  H01Q1/50 ,  H01Q1/38 ,  H01Q1/48

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q1/521 ,  H01Q5/00 ,  H01Q9/00 ,  H01Q21/28

Abstract: An electronic device is provided including a housing including a first plate, a second plate facing the first plate, and a side member between the first and second plate, a radio frequency (RF) circuit, a processor, a ground member, a first electric path connected between a first port of the RF circuit and a first point of a first conductive portion of the side member, a second electric path connected between a second port of the RF circuit and a first point of a second conductive portion of the side member, a third electric path connected between a second point of the first conductive portion and the ground member, a fourth electric path connected between a second point of the second conductive portion and the ground member, and a fifth electric path connected between one point of the second electric path and one point of the third electric path.