公开(公告)号：US20150262620A1

公开(公告)日：2015-09-17

申请号：US14712530

申请日：2015-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Hyung SONG ,  Kyoung-Sun KIM ,  Yong Jin KIM ,  Jae-Jun LEE ,  Sang-Seok KANG ,  Jung-Joon LEE

IPC: G11C5/02

CPC classification number: G11C5/04 ,  G06F13/102 ,  G06F13/4068 ,  G06F13/42 ,  G11C5/02 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/074 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.

Abstract translation: 提供了一种包括印刷电路板的存储器模块; 设置在印刷电路板的一个表面上的第一半导体封装; 以及设置在所述印刷电路板的另一个表面上的第二半导体封装，所述第一半导体封装和所述第二半导体封装具有形成等级的半导体管芯。 由第一半导体封装形成的多个等级由与第二半导体封装形成的等级数不同。 形成相同行列的半导体封装共同接收芯片选择信号，形成其他级别的半导体封装接收不同的芯片选择信号。

公开(公告)号：US20130194765A1

公开(公告)日：2013-08-01

申请号：US13754906

申请日：2013-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Hyeon CHO ,  Jae-Jun LEE ,  Jung-Joon LEE ,  Baek Kyu CHOI ,  Seung-Jin SEO

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H05K1/14 ,  H05K1/141 ,  H05K1/182 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/2018 ,  H05K2203/166

Abstract: A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket.

Abstract translation: 提供半导体模块组件。 半导体模块组件包括主板，插座和半导体模块。 主板包括用于接收半导体模块的开口，该开口至少包括三个侧面。 插座沿着至少三个侧面的至少第一侧面，第二侧面和第三侧设置在开口中。 半导体模块设置在插座中。 半导体模块包括安装在模块板上的至少一个半导体器件。 插座至少包括沿着开口的第一侧的第一侧和沿着开口的第二侧的第二侧，并且半导体模块至少通过插座的第一和第二侧电连接到母板。