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公开(公告)号:US20220386007A1
公开(公告)日:2022-12-01
申请号:US17850080
申请日:2022-06-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kwanghyun KIM , Kyueun PARK , Brian HAN
Abstract: An electronic device according to various embodiments may include: a housing, an acoustic hole formed in a first direction of the housing, an instrument installed in the housing in a second direction perpendicular to the first direction, a mic, and a mic holder including a body installed in the housing, a seat formed in the body part to receive the mic, a first opening formed in one surface of the body and connected to the seat, a second opening formed in another surface of the body, and a third opening formed in the body and connected to the acoustic hole. As the second opening of the mic holder is closed by an instrument of the electronic device closely attached to the other surface of the body part, an acoustic channel in which a sound introduced into the third opening is delivered to a mic hole of the mic may be formed.
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公开(公告)号:US20230221775A1
公开(公告)日:2023-07-13
申请号:US18188057
申请日:2023-03-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jangsun YOO , Kwanghyun KIM , Myeonggil LEE , Jihye MOON , Kyueun PARK
CPC classification number: G06F1/1688 , H01Q1/2266 , G06F1/1656 , G06F1/1698 , H01Q1/36
Abstract: An electronic device including a housing is provided. The electronic device includes a display module, a communication module, a processor, and a speaker, wherein the speaker includes a speaker enclosure in which a first case and a second case are combined, and the speaker enclosure is arranged in the inner space of the housing and spaced apart from the housing at a predetermined interval, a first antenna pattern is arranged on the surface of the first case, a second antenna pattern is arranged on the surface of the second case, the first antenna pattern and the second antenna pattern are electrically coupled to each other, and the first antenna pattern and the second antenna pattern may be arranged to prevent overlapping with a speaker component arranged inside the speaker enclosure.
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