公开(公告)号：US11107743B2

公开(公告)日：2021-08-31

申请号：US16673127

申请日：2019-11-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Tae Hwang ,  Jae-Choon Kim ,  Kyung-Suk Oh ,  Woon-Bae Kim ,  Jae-Min Jung

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/14

Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

公开(公告)号：US20200303276A1

公开(公告)日：2020-09-24

申请号：US16673127

申请日：2019-11-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Tae Hwang ,  Jae-Choon Kim ,  Kyung-Suk Oh ,  Woon-Bae Kim ,  Jae-Min Jung

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/14

Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

公开(公告)号：US11756850B2

公开(公告)日：2023-09-12

申请号：US17462269

申请日：2021-08-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Tae Hwang ,  Jae-Choon Kim ,  Kyung-Suk Oh ,  Woon-Bae Kim ,  Jae-Min Jung

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/14

CPC classification number: H01L23/3135 ,  H01L23/4985 ,  H01L23/49838 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10128

Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.