公开(公告)号：US20240260190A1

公开(公告)日：2024-08-01

申请号：US18290322

申请日：2022-04-28

申请人： ELECTROLUX APPLIANCES AKTIEBOLAG

发明人： Alex VIROLI ,  Massimo NOSTRO ,  Adriano SCOTTO D'APOLLONIA ,  Massimo ZANGOLI ,  Emanuel URGESE ,  Elia SCHIARATURA ,  Alan MENGOZZI

IPC分类号： H05K1/14 ,  H05B6/12 ,  H05K3/34

CPC分类号： H05K1/141 ,  H05B6/12 ,  H05K3/34 ,  H05K2201/0137 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/049

摘要： Induction cooking hob comprising at least one first board element (18) and at least one second board element (16), wherein the first board element (18) and at least one second board element (16) each comprise at least one or more electrical and/or electronical component(s), wherein the first board element (18) is electrically coupled to the second board element (16) and wherein the first board element (18) is directly mechanically coupled to the second board element (16.

公开(公告)号：US11917747B2

公开(公告)日：2024-02-27

申请号：US17695776

申请日：2022-03-15

申请人： Chicony Electronics Co., Ltd.

发明人： Chien-Yueh Chen

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K1/05 ,  H04N23/52 ,  H04N23/54

CPC分类号： H05K1/0212 ,  H04N23/52 ,  H04N23/54 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/141 ,  H05K1/05 ,  H05K2201/049 ,  H05K2201/10083 ,  H05K2201/10106

摘要： A circuit board module includes a circuit board, a metal core printed circuit board, and a heating element. The circuit board includes a substrate, and a surface of the substrate has an assembling region. The metal core printed circuit board is on the assembling region and includes a first circuit layer and a second circuit layer. The first circuit layer and the second circuit layer are electrically connected to each other. The second circuit layer is electrically connected to the circuit board. The thermal conductivity of the metal core printed circuit board is greater than the thermal conductivity of the substrate. The heating element is on the metal core printed circuit board and is electrically connected to the first circuit layer. An electronic device having the circuit board module is also provided.

公开(公告)号：US20230328876A1

公开(公告)日：2023-10-12

申请号：US18208923

申请日：2023-06-13

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Yong Jin SHIN ,  Kyun Ho Kim ,  Uk Jae Jang ,  Bong Im Park

IPC分类号： H05K1/02 ,  H05K1/18 ,  H01L23/498 ,  H05K1/14 ,  G09G3/00

CPC分类号： H05K1/0268 ,  H05K1/18 ,  H01L23/49838 ,  H05K1/14 ,  G09G3/006 ,  G09G2330/12 ,  H01L23/4985 ,  H05K2201/049 ,  H05K2201/10128

摘要： A display device including: a display panel; a first substrate attached to a side of the display panel; and a second substrate attached to a side of the first substrate, wherein the display panel includes a first panel test pad and a second panel test pad, the first substrate includes a 1-1 circuit test lead overlapping and connected to the first panel test pad, a 1-2 circuit test lead overlapping and connected to the second panel test pad, a 2-1 circuit test lead overlapping and connected to the second substrate, a 1-1 test lead line connected to the 1-1 circuit test lead, a 1-2 test lead line connected to the 1-2 circuit test lead, and a first test lead line connected to the 2-1 circuit test lead, and the 1-1 test lead line and the 1-2 test lead line are connected to the first test lead line.

公开(公告)号：US11785720B2

公开(公告)日：2023-10-10

申请号：US17236026

申请日：2021-04-21

申请人： Murata Manufacturing Co., Ltd.

发明人： Satoshi Yokomizo

IPC分类号： H05K1/18 ,  H01G4/232 ,  H05K1/14 ,  H05K1/11 ,  H01G4/12 ,  H01G4/30

CPC分类号： H05K1/181 ,  H01G4/232 ,  H05K1/112 ,  H05K1/141 ,  H01G4/1227 ,  H01G4/30 ,  H05K2201/049 ,  H05K2201/09672 ,  H05K2201/10015 ,  H05K2201/10378

摘要： A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

公开(公告)号：US11756850B2

公开(公告)日：2023-09-12

申请号：US17462269

申请日：2021-08-31

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seung-Tae Hwang ,  Jae-Choon Kim ,  Kyung-Suk Oh ,  Woon-Bae Kim ,  Jae-Min Jung

IPC分类号： H01L23/31 ,  H01L23/498 ,  H05K1/14

CPC分类号： H01L23/3135 ,  H01L23/4985 ,  H01L23/49838 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10128

摘要： A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

公开(公告)号：US11668984B2

公开(公告)日：2023-06-06

申请号：US17715496

申请日：2022-04-07

申请人： Japan Display Inc.

发明人： Hideaki Abe ,  Yasuhito Aruga ,  Hiroyuki Onodera ,  Hiroki Kato ,  Yasushi Nakano ,  Hitoshi Kawaguchi ,  Keisuke Asada

IPC分类号： H05K1/11 ,  G02F1/1345 ,  H05K3/36 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H01L27/12 ,  G02F1/1368 ,  G02F1/1333

CPC分类号： G02F1/13452 ,  G02F1/13458 ,  H05K1/0266 ,  H05K1/11 ,  H05K1/144 ,  H05K1/181 ,  H05K3/368 ,  G02F1/1368 ,  G02F1/133354 ,  G02F2202/28 ,  H01L27/1214 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09936 ,  H05K2201/10136 ,  H05K2203/166

摘要： A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

公开(公告)号：US20190206701A1

公开(公告)日：2019-07-04

申请号：US16226268

申请日：2018-12-19

申请人： Gerald Ho Kim

发明人： Gerald Ho Kim

IPC分类号： H01L21/48 ,  H01L23/373 ,  H01L23/367 ,  H01S5/024

CPC分类号： H01L21/4882 ,  H01L21/4803 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3738 ,  H01L31/02327 ,  H01L31/024 ,  H01L33/483 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0075 ,  H01S5/02469 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174 ,  H01L2924/00

摘要： Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

公开(公告)号：US20180151820A1

公开(公告)日：2018-05-31

申请号：US15578153

申请日：2016-07-20

申请人： KANEKA CORPORATION

发明人： Hidemaro Saiki

IPC分类号： H01L51/50 ,  F21V23/00 ,  F21K9/278 ,  F21K9/238 ,  H05K1/18 ,  H05B33/06

CPC分类号： H01L51/5012 ,  F21K9/238 ,  F21K9/278 ,  F21S2/00 ,  F21V23/00 ,  H01L51/5008 ,  H01L51/5203 ,  H05B33/06 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/189 ,  H05K2201/049 ,  H05K2201/10106 ,  H05K2201/10272

摘要： Provided is a planar light emitting device which is highly productive employing inexpensive FPCs capable of being easily electrically connected, and which has a light emitting region with reduced unevenness in luminance and hence is highly reliable. The planar light emitting device, which has a light emitting surface and a back surface, includes a planar light emitting tile including a planar light emitting element and a plurality of flexible printed circuits (FPCs) disposed on the back surface. The planar light emitting tile includes a non-pad region where none of an anode pad and a cathode pad are disposed. In an overlapped region where part of two circuit boards overlap each other, an electrical connection site where an equipotential region of the two circuit boards are directly electrically connected to each other is formed. The non-pad region forms a connecting-part disposed region that overlaps with the electrical connection site.

公开(公告)号：US20180144868A1

公开(公告)日：2018-05-24

申请号：US15645601

申请日：2017-07-10

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Heung Kil PARK ,  Jong Hwan PARK ,  Se Hun PARK ,  Young Ghyu AHN

IPC分类号： H01G4/30 ,  H01G4/228 ,  H05K1/18 ,  H01G4/005

CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/228 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/10015 ,  Y02P70/613

摘要： A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.

公开(公告)号：US09961774B2

公开(公告)日：2018-05-01

申请号：US15010465

申请日：2016-01-29

申请人： Peraso Technologies Inc.

发明人： Marc Supinski

IPC分类号： H04B17/00 ,  H05K1/18 ,  H04B17/12 ,  G01R29/10 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q1/12 ,  H04B17/17 ,  H05K1/14

CPC分类号： H05K1/18 ,  G01R29/10 ,  H01Q1/12 ,  H01Q1/38 ,  H01Q1/50 ,  H04B17/12 ,  H04B17/17 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10098

摘要： A wireless communication assembly includes a first support member carrying a baseband processor and a radio processor, and defining a first mounting surface including a first pair of electrical contacts. The first support member has a first pair of electrical connections between the radio processor and the first electrical contacts. The assembly also includes a second support member carrying an antenna and defining a second mounting surface including a second pair of electrical contacts. The second support member has a second pair of electrical connections between the antenna and the second electrical contacts. The second mounting surface is configured to engage the first mounting surface to rigidly couple the first and second support members and to bring the first pair of electrical contacts into contact with the second pair of electrical contacts for electrically connecting the radio processor and the antenna via the first and second pairs of electrical connections.