公开(公告)号：US20240357518A1

公开(公告)日：2024-10-24

申请号：US18763487

申请日：2024-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaemoon CHA ,  Kyunghoon MOON ,  Jungsuk WOO ,  Jaegon GHIM

IPC: H04W52/36 ,  H04W52/16 ,  H04W52/38

CPC classification number: H04W52/367 ,  H04W52/16 ,  H04W52/38

Abstract: According to various embodiments, an electronic device configures a first maximum transmission power limit for a first RF path, transmits, through the first RF path, a first RF signal using transmission power configured based on the first maximum transmission power limit, configures a second maximum transmission power limit for a second RF path, transmits, through the second RF path, a second RF signal using transmission power configured based on the second maximum transmission power limit; identifies whether an RF path change condition is satisfied, transmits, through a third RF path, the second RF signal using transmission power configured based on a third maximum transmission power limit and transmits, through the first RF path, the first RF signal using the transmission power configured based on the first maximum transmission power limit. Various other embodiments are possible.

公开(公告)号：US20240014544A1

公开(公告)日：2024-01-11

申请号：US18470038

申请日：2023-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil JEON ,  Namwoo KIM ,  Seongbeom HONG ,  Kyunghoon MOON ,  Yunbum LEE

IPC: H01Q1/24 ,  H04M1/02 ,  H01Q21/06

CPC classification number: H01Q1/243 ,  H04M1/0277 ,  H04M1/0266 ,  H01Q21/065

Abstract: An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes a conductive first portion forming a lateral appearance of the electronic device, a second portion adjacent to the array antenna, the front cover, and the conductive first portion, and having at least one opening filled with a non-conductive material, and a third portion including a non-conductive material and disposed adjacent to the array antenna, the rear cover, and the conductive first portion. The conductive first portion is exposed to an outside of the electronic device, and the second and third portions are hidden by the front and rear covers. A beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.

公开(公告)号：US20210249751A1

公开(公告)日：2021-08-12

申请号：US17162110

申请日：2021-01-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunbum LEE ,  Seongbeom HONG ,  Kyunghoon MOON ,  Seunggil JEON ,  Jaeyoung HUH ,  Jinsang KIM ,  Sungchul PARK

IPC: H01Q1/02 ,  H01Q21/08 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a display having a first surface, a metal frame structure configured to form a side surface of the electronic device, a rear plate having a second surface facing a third direction, at least one antenna module disposed inside the side surface and having a radiation surface, at least one dielectric layer having at least a partial region attached to the radiation surface, and a wireless communication circuit configured to transmit or receive an radio frequency (RF) signal to or from the at least one antenna module, in which the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, in which the first dielectric sheet is made of a thermal conductive material having a first permittivity and the second dielectric sheet is made of a material having a second permittivity larger than the first permittivity.

公开(公告)号：US20250149773A1

公开(公告)日：2025-05-08

申请号：US19013690

申请日：2025-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungjoon KIM ,  Heejin PARK ,  Kyunghoon MOON ,  Sungsoo KIM ,  Yongyoun KIM ,  Youngjoon LIM

IPC: H01Q1/22 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a first housing forming at least a part of a side surface of the electronic device, wherein a first opening is formed in the first housing, a first conductive structure formed on the inside the first opening, and an antenna module, wherein the antenna module includes a printed circuit board (PCB), a plurality of conductive patches disposed on the PCB to face the first opening, and a wireless communication circuit, wherein, as the wireless communication circuit is configured to feed power to the plurality of conductive patches, a first electric path is formed in the first conductive structure which is spaced apart from the plurality of conductive patches, and wherein a radio frequency (RF) signal generated based on the first electric path is radiated to an outside of the electronic device.

公开(公告)号：US20200259243A1

公开(公告)日：2020-08-13

申请号：US16788925

申请日：2020-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil JEON ,  Namwoo KIM ,  Seongbeom HONG ,  Kyunghoon MOON ,  Yunbum LEE

IPC: H01Q1/24

Abstract: Disclosed is an electronic device including a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the first plate and the second plate, a first antenna structure disposed to be substantially parallel with the second plate in the space, and including a substrate disposed in the space, and at least one antenna element disposed on the substrate to face at least the second plate, a conductive member disposed in the space and spaced apart from the at least one antenna element by a predetermined interval when the second plate is viewed from above.

公开(公告)号：US20180323754A1

公开(公告)日：2018-11-08

申请号：US15862213

申请日：2018-01-04

Applicant: Samsung Electronics Co., Ltd. ,  POSTECH ACADEMY-INDUSTRY FOUNDATION

Inventor： Jihoon KIM ,  Bumman KIM ,  Kyunghoon MOON ,  Seokwon LEE ,  Daechul JEONG ,  Byungjoon PARK ,  Juho SON

IPC: H03F1/56 ,  H03F3/21 ,  H03F3/193 ,  H03F1/32

Abstract: The method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT) are provided. The method includes intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The system includes a power amplification device capable of minimizing the effect of envelope impedance. The power amplification device may be incorporated in a terminal and a base station.