公开(公告)号：US20240170431A1

公开(公告)日：2024-05-23

申请号：US18228746

申请日：2023-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang-Kun KANG ,  Taehyung KIM ,  Mi Hyae PARK

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/13 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/11462 ,  H01L2224/11622 ,  H01L2224/11903 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/13023 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2924/2064 ,  H01L2924/3512

Abstract: A bonding structure of a semiconductor package device that physically and electrically connects between a semiconductor chip and a package substrate or between a package substrate and a board, the bonding structure includes a solder; a main pad that faces the solder; and an electrically conductive support structure that is connected between the solder and the main pad, the electrically conductive support structure including a sub pad bonded to the solder, the sub pad being spaced apart from the main pad and facing the main pad, and at least one leg extending from the sub pad to the main pad.

公开(公告)号：US20240194641A1

公开(公告)日：2024-06-13

申请号：US18348011

申请日：2023-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi Woo LEE ,  Hyeonjeong HWANG ,  Mi Hyae PARK

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L23/538

CPC classification number: H01L25/0652 ,  H01L23/3157 ,  H01L23/528 ,  H01L23/5383 ,  H01L24/08 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/08155 ,  H01L2224/16227

Abstract: Disclosed are semiconductor packages and fabrication methods thereof. The semiconductor package includes a substrate, a first semiconductor chip and a second semiconductor chip that are mounted on the substrate, and a bridge chip between a first lateral surface of the first semiconductor chip and a second lateral surface of the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are electrically connected through the bridge chip. The first semiconductor chip includes a first chip pad on the first lateral surface. The bridge chip includes a first connection pad on a first surface of the bridge chip. The first lateral surface of the first semiconductor chip and the first surface of the bridge chip are in contact with each other. The first chip pad and the first connection pad include a same material and are bonded to each other to constitute an integral piece formed.