PHOTORESIST COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20230130025A1

    公开(公告)日:2023-04-27

    申请号:US17938338

    申请日:2022-10-06

    Abstract: A photoresist composition including an organometallic compound, and a method for fabricating a semiconductor device using the same are provided. The photoresist composition may include an organometallic compound, a radical sensitizer including a structure of Chemical formula 2-1 or Chemical formula 2-2, and a solvent.
    In Chemical formula 2-1, A1 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, and R1, R2 and R3 are each independently hydrogen, a halogen, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or a hetero-functional group.
    In Chemical formula 2-2, A2 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, and R4 and R5 are each independently hydrogen, a halogen, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or a hetero-functional group.

    DEVICE FOR SUPPLYING POWER TO EXTERNAL DEVICE AND METHOD THEREFOR

    公开(公告)号:US20190341786A1

    公开(公告)日:2019-11-07

    申请号:US16473967

    申请日:2018-02-12

    Abstract: Disclosed is an electronic device. The electronic device may include a plurality of interfaces each of which is connected to one peripheral electronic device in a wired manner to deliver power to the connected peripheral electronic device, a power supply circuit connected to the plurality of interfaces, and a control circuit including a plurality of pins each connected to one interface to allow the power supply circuit to supply power to the plurality of interfaces. In addition, various embodiments understood from the disclosure are possible.

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