公开(公告)号：US11516917B2

公开(公告)日：2022-11-29

申请号：US17172351

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon Park ,  Younggirl Yun ,  Sunggeun Kang ,  Myungsub Ko ,  Jaeyeon Ra ,  Seungbo Shim ,  Yongjin Woo ,  Junhee Han

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.

公开(公告)号：US20210251079A1

公开(公告)日：2021-08-12

申请号：US17172351

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon PARK ,  Younggirl Yun ,  Sunggeun Kang ,  Myungsub Ko ,  Jaeyeon Ra ,  Seungbo Shim ,  Yongjin Woo ,  Junhee Han

IPC: H05K1/14 ,  H05K1/02

Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.